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1. WO2013008371 - スパークプラグ

公開番号 WO/2013/008371
公開日 17.01.2013
国際出願番号 PCT/JP2012/002640
国際出願日 17.04.2012
IPC
H01T 13/08 2006.01
H電気
01基本的電気素子
Tスパークギャップ;スパークギャップを用いる過電圧避雷器;スパークプラグ;コロナ放電装置;密閉されない気体中へ導入されるイオンの発生
13スパークプラグ
02細部
08スパークプラグの取り付け,固定または封止,例.燃焼室内
F02P 13/00 2006.01
F機械工学;照明;加熱;武器;爆破
02燃焼機関;熱ガスまたは燃焼生成物を利用する機関設備
P内燃機関の点火で圧縮点火以外のもの;圧縮点火機関の点火時期の試験
13内燃機関の他の部品と結合した構造の点火プラグ
CPC
F16J 15/061
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
JPISTONS
15Sealings
02between relatively-stationary surfaces
06with solid packing compressed between sealing surfaces
061with positioning means
F16J 15/0881
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
JPISTONS
15Sealings
02between relatively-stationary surfaces
06with solid packing compressed between sealing surfaces
08with exclusively metal packing
0881the sealing effect being obtained by plastic deformation of the packing
H01L 2224/32245
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32245the item being metallic
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
出願人
  • 日本特殊陶業株式会社 NGK SPARK PLUG CO., LTD. [JP]/[JP] (AllExceptUS)
  • 鈴木 彰 SUZUKI, Akira [JP]/[JP] (UsOnly)
発明者
  • 鈴木 彰 SUZUKI, Akira
代理人
  • 青木 昇 AOKI, Noboru
優先権情報
2011-15278211.07.2011JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SPARK PLUG
(FR) BOUGIE D'ALLUMAGE
(JA) スパークプラグ
要約
(EN)
Provided is a technology that ensures air-tightness and can inhibit gasket looseness. A spark plug is provided with a cylindrical body extending in the direction of an axis, and an annular gasket provided around the outside of the body. The gasket is solid, is composed mainly of copper, and contains at least 0.1% nickel by weight. The maximum thickness of the gasket in the direction of said axis is at least 0.4 mm, and the Vickers hardness of the gasket is between 30 and 150 HV.
(FR)
L'invention concerne une technologie qui assure une étanchéité vis-à-vis de l'air et qui peut empêcher un desserrage de joint d'étanchéité. L'invention porte également sur une bougie d'allumage, qui comporte un corps cylindrique s'étendant dans la direction d'un axe, et un joint d'étanchéité annulaire disposé autour de l'extérieur du corps. Le joint d'étanchéité est plein, il est constitué principalement par du cuivre, et il contient au moins 0,1 % en poids de nickel. L'épaisseur maximale du joint d'étanchéité dans la direction dudit axe est d'au moins 0,4 mm et la dureté Vickers du joint d'étanchéité est entre 30 et 150 HV.
(JA)
気密性を確保するとともに、ガスケットの緩みを抑制することのできる技術を提供する。スパークプラグは、軸線方向に延びる筒状の主体金具と、主体金具の外周に設けられた環状のガスケットとを備える。ガスケットは、中実であるとともに、主成分が銅であり、かつ、ニッケルを0.1重量%以上含む。ガスケットの軸線方向における最大の厚さは、0.4mm以上であり、ガスケットのビッカース硬さは、30HV以上150HV以下である。
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