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1. WO2012081479 - 多層共押出ポリイミドフィルムの製造方法

パーマリンク
公開番号 WO/2012/081479
公開日 21.06.2012
国際出願番号 PCT/JP2011/078343
国際出願日 07.12.2011
IPC
B29C 41/32 2006.1
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
Cプラスチックの成形または接合;他に分類されない可塑状態の材料の成形;成形品の後処理,例.補修
41型,コアまたはその他の基体を被覆することによる成形,すなわち,材料を付着し成形品を剥離することによる成形;そのための装置
24不定長の物品を製造するためのもの
32多層または多色物品の製造
C08G 73/10 2006.1
C化学;冶金
08有機高分子化合物;その製造または化学的加工;それに基づく組成物
G炭素-炭素不飽和結合のみが関与する反応以外の反応によって得られる高分子化合物
73グループC08G12/00~C08G71/00に属さない,高分子の主鎖に酸素または炭素を有しまたは有せずに窒素を含む連結基を形成する反応により得られる高分子化合物
06高分子の主鎖に窒素含有複素環を有する重縮合物;ポリヒドラジド;ポリアミド酸または類似のポリイミド前駆物質
10ポリイミド;ポリエステル―イミド;ポリアミド―イミド;ポリアミド酸または類似のポリイミド前駆物質
B29K 79/00 2006.1
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
KサブクラスB29B,B29CまたはB29Dに関連する成形材料,あるいは補強材,充填材,予備成形部品(たとえば挿入物)用の材料についてのインデキシング系列
79,,
B29L 9/00 2006.1
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
LサブクラスB29Cに関連する特定物品についてのインデキシング系列
9,,
H05K 1/03 2006.1
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
03基体用材料の使用
CPC
B29C 48/08
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
48Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
03characterised by the shape of the extruded material at extrusion
07Flat, e.g. panels
08flexible, e.g. films
B29C 48/21
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
48Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
16Articles comprising two or more components, e.g. co-extruded layers
18the components being layers
21the layers being joined at their surfaces
B29K 2079/08
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR ; MOULDS, ; REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
2079Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain ; , not provided for in groups B29K2061/00 - B29K2077/00; , as moulding material
08PI, i.e. polyimides or derivatives thereof
B29K 2079/085
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR ; MOULDS, ; REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
2079Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain ; , not provided for in groups B29K2061/00 - B29K2077/00; , as moulding material
08PI, i.e. polyimides or derivatives thereof
085Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
C08G 73/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
出願人
  • 株式会社カネカ KANEKA CORPORATION [JP]/[JP] (AllExceptUS)
  • 松谷　晃男 MATSUTANI, Teruo (UsOnly)
  • 近藤　康孝 KONDO, Yasutaka (UsOnly)
発明者
  • 松谷　晃男 MATSUTANI, Teruo
  • 近藤　康孝 KONDO, Yasutaka
代理人
  • 特許業務法人原謙三国際特許事務所 HARAKENZO WORLD PATENT & TRADEMARK
優先権情報
2010-27858814.12.2010JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) METHOD FOR PRODUCING MULTILAYERED CO-EXTRUDED POLYIMIDE FILM
(FR) PROCÉDÉ POUR LA PRODUCTION D'UN FILM DE POLYIMIDE COEXTRUDÉ MULTICOUCHE
(JA) 多層共押出ポリイミドフィルムの製造方法
要約
(EN) Provided is a method for producing multilayered co-extruded polyimide film, with which the partial sticking of a polyimide layer onto a substrate that occurs when a polyamide acid solution is cast by multilayered co-extrusion onto the substrate in order to produce a multilayered polyimide film by multilayered co-extrusion is prevented by adding an imidation catalyst to only the polyamide acid solution that comes into direct contact with the substrate.
(FR) L'invention concerne un procédé pour la production d'un film de polyimide coextrudé multicouche, grâce auquel l'adhérence partielle d'une couche de polyimide sur un substrat, qui survient quand une solution acide de polyamide est moulée par coextrusion multicouche sur le substrat en vue de produire un film de polyimide coextrudé multicouche par coextrusion multicouche, est évitée en ajoutant un catalyseur d'imidation uniquement dans la solution acide de polyamide qui entre en contact direct avec le substrat.
(JA) 　多層共押出にて多層ポリイミドフィルムを製造するときに、支持体に直接接するポリアミド酸溶液中のみにイミド化触媒を含有せしめることによって、多層共押出でポリアミド酸溶液を支持体上に流延した際に、支持体上にポリイミド層が部分的に貼り付くことを防ぐ。
関連特許文献
JP2014040003
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