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1. WO2011129161 - モジュール基板、モジュール基板の製造方法、及び端子接続基板

公開番号 WO/2011/129161
公開日 20.10.2011
国際出願番号 PCT/JP2011/055028
国際出願日 04.03.2011
IPC
H05K 1/18 2006.1
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
18印刷によらない電気部品と構造的に結合した印刷回路
H05K 3/00 2006.1
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
CPC
H01L 21/561
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
561Batch processing
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/16227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16227the bump connector connecting to a bond pad of the item
H01L 2224/45147
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45147Copper (Cu) as principal constituent
H01L 2224/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
出願人
  • 株式会社村田製作所 Murata Manufacturing Co.,Ltd. [JP]/[JP] (AllExceptUS)
  • 山元 一生 YAMAMOTO Issei [JP]/[JP] (UsOnly)
発明者
  • 山元 一生 YAMAMOTO Issei
代理人
  • 福永 正也 FUKUNAGA Masaya
優先権情報
2010-09191313.04.2010JP
2010-10479130.04.2010JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) MODULE SUBSTRATE, PRODUCTION METHOD FOR MODULE SUBSTRATE, AND TERMINAL CONNECTION BOARD
(FR) SUBSTRAT POUR MODULES, PROCÉDÉ DE PRODUCTION D'UN SUBSTRAT POUR MODULES ET CARTE DE CONNEXION DE BORNES
(JA) モジュール基板、モジュール基板の製造方法、及び端子接続基板
要約
(EN) Provided is a module substrate, a production method for the module substrate, and a terminal connection board whereby terminals can be reliably connected without shorting between terminal electrodes and a simpler production process can be achieved. A plurality of terminal connection boards (14), which have a plurality of columnar terminal electrodes (142) positioned on one surface or both surfaces of an insulator (141), are mounted on one surface of a collective substrate (1), such that at least a plurality of adjacent module substrates are straddled. The collective substrate (1), with a plurality of terminal connection substrates (14) on one surface and a plurality of electronic components (12) on at least one surface, is divided at positions where the module substrate is to be cut.
(FR) L'invention concerne un substrat pour modules, un procédé de production du substrat pour modules et une carte de connexion de bornes qui permet de relier des bornes de manière fiable sans courts-circuits entre électrodes de bornes et de réaliser un processus de production plus simple. Une pluralité de cartes (14) de connexion de bornes, munies d'une pluralité d'électrodes (142) de bornes en colonnes positionnées sur une ou sur les deux surfaces d'un isolant (141), est montée sur une surface d'un substrat collectif (1), de manière à chevaucher au moins une pluralité de substrats adjacents pour modules. Le substrat collectif (1), doté d'une pluralité de cartes (14) de connexion de bornes sur une surface et d'une pluralité de composants électroniques (12) sur au moins une surface, est divisé à des emplacements où le substrat pour modules est appelé à être découpé.
(JA)  製造工程を簡素化しつつ、端子電極同士を短絡させることなく確実に接続することができるモジュール基板、モジュール基板の製造方法及び端子接続基板を提供する。 複数の柱状の端子電極142を絶縁体141の一側面又は両側面に配置してある端子接続基板14を、少なくとも隣接する複数のモジュール基板を跨ぐように、集合基板1の片面に複数実装する。片面に複数の端子接続基板14、及び少なくとも片面に複数の電子部品12を実装した集合基板1を、モジュール基板を切り出す位置で分断する。
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