処理中

しばらくお待ちください...

PATENTSCOPE は、メンテナンスのため次の日時に数時間サービスを休止します。サービス休止: 土曜日 31.10.2020 (7:00 午前 CET)
設定

設定

出願の表示

1. WO2011077880 - 電子回路部品供給装置

公開番号 WO/2011/077880
公開日 30.06.2011
国際出願番号 PCT/JP2010/070783
国際出願日 22.11.2010
IPC
H05K 13/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
13電気部品の組立体の製造または調整に特に適した装置または方法
02部品の供給
CPC
H05K 13/0417
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0417Feeding with belts or tapes
H05K 13/0419
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
0417Feeding with belts or tapes
0419tape feeders
Y10S 156/93
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
156Adhesive bonding and miscellaneous chemical manufacture
918Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
93Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
Y10S 156/941
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
156Adhesive bonding and miscellaneous chemical manufacture
934Apparatus having delaminating means adapted for delaminating a specified article
941Means for delaminating semiconductive product
Y10T 156/1994
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
19Delaminating means
1994Means for delaminating from release surface
出願人
  • 富士機械製造株式会社 FUJI MACHINE MFG. CO., LTD. [JP]/[JP] (AllExceptUS)
  • 勝見 裕司 KATSUMI, Hiroshi [JP]/[JP] (UsOnly)
  • 高田 幸則 TAKADA, Yukinori [JP]/[JP] (UsOnly)
発明者
  • 勝見 裕司 KATSUMI, Hiroshi
  • 高田 幸則 TAKADA, Yukinori
代理人
  • 特許業務法人中部国際特許事務所 CHUBU PATENT OFFICE
優先権情報
2009-29646126.12.2009JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) ELECTRONIC CIRCUIT COMPONENT SUPPLYING APPARATUS
(FR) APPAREIL DE FOURNITURE DE COMPOSANTS DE CIRCUIT ÉLECTRONIQUE
(JA) 電子回路部品供給装置
要約
(EN)
Disclosed is an electronic circuit component supplying apparatus which can supply as many kinds of electronic circuit components as possible in a region having a narrow width. A plurality of tape feeders (58) are held by a feeder holding apparatus, in a state wherein the component supplying sections (110) of the tape feeders are arranged in a plurality of rows along a plurality of straight lines extending in parallel to each other on one plane. Each of the tape feeders (58) can be separated into: first sections (102, 104) that include a reel holding section (112), which holds a reel (199) having a component-on-tape material (152) wound thereon, a component supplying section (110), and a component-on-tape material guide section (114), which guides the component-on-tape material pulled out from the reel to the component supplying section; and second sections (106, 108), that include component-on-tape material feeding apparatuses (142, 162) that feed the component-on-tape to the component supplying section. It is preferable that the first section is an attachable/detachable unit that can be attached integrally to and detached from the second section.
(FR)
La présente invention se rapporte à un appareil de fourniture de composants de circuit électronique qui peut fournir autant de types de composants de circuit électronique que possible dans une région de faible largeur. Une pluralité de dispositifs d'alimentation de bande (58) est maintenue par un appareil de maintien de dispositifs d'alimentation, dans un état où les sections de fourniture de composants (110) des dispositifs d'alimentation de bande sont agencées en une pluralité de rangées le long d'une pluralité de lignes droites s'étendant parallèlement les unes aux autres sur un plan unique. Chacun des dispositifs d'alimentation de bande (58) peut être séparé en : des premières sections (102, 104) qui comprennent une section de maintien de bobine (112) qui maintient une bobine (199) sur laquelle est enroulé un matériau de composant sur bande (152), une section de fourniture de composant (110), et une section de guidage de matériau de composant sur bande (114) qui guide le matériau de composant sur bande déroulé de la bobine vers la section de fourniture de composant ; et des secondes sections (106, 108) qui comprennent des appareils de fourniture de matériau de composant sur bande (142, 162) qui fournissent le composant sur bande à la section de fourniture de composant. De préférence, la première section est une section attachable/détachable qui peut être attachée d'un seul tenant à la seconde section et qui peut en être détachée.
(JA)
幅の狭い領域内において可及的に多くの種類の電子回路部品を供給可能な電子回路部品供給装置を得る。複数のテープフィーダ58を、それらの部品供給部110が一平面上に、かつ、互いに平行に延びる複数の直線の各々に沿って複数列に並ぶ状態で、フィーダ保持装置に保持させる。複数のテープフィーダ58の各々を、テープ化部品152が巻かれたリール199を保持するリール保持部112と、部品供給部110と、リールから引き出されたテープ化部品を部品供給部に導くテープ化部品案内部114とを含む第1部102,104と、テープ化部品を部品供給部へ送るテープ化部品送り装置142,162を含む第2部106,108とに分離可能とし、第1部を第2部に対して一体的に着脱可能な着脱ユニットとすることが望ましい。
国際事務局に記録されている最新の書誌情報