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出願の表示

1. WO2011067946 - 回路基板、回路モジュール、及び電子機器

公開番号 WO/2011/067946
公開日 09.06.2011
国際出願番号 PCT/JP2010/007073
国際出願日 03.12.2010
IPC
H05K 3/46 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
46多重層回路の製造
H05K 1/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
H05K 1/18 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
18印刷によらない電気部品と構造的に結合した印刷回路
H05K 9/00 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
9電場または磁場に対する装置または部品の遮へい
CPC
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2924/15153
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
151Die mounting substrate
1515Shape
15153the die mounting substrate comprising a recess for hosting the device
H01L 2924/15313
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
151Die mounting substrate
153Connection portion
1531the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
15313being a land array, e.g. LGA
H01L 2924/19105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19105in a side-by-side arrangement on a common die mounting substrate
H01L 2924/3025
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
30Technical effects
301Electrical effects
3025Electromagnetic shielding
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
出願人
  • パナソニック株式会社 Panasonic Corporation [JP]/[JP] (AllExceptUS)
  • 井上 勝裕 INOUE, Katsuhiro (UsOnly)
発明者
  • 井上 勝裕 INOUE, Katsuhiro
代理人
  • 小栗 昌平 OGURI, Shohei
優先権情報
2009-27629204.12.2009JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) CIRCUIT BOARD, CIRCUIT MODULE, AND ELECTRONIC DEVICE
(FR) CARTE DE CIRCUIT IMPRIMÉ, MODULE DE CIRCUIT IMPRIMÉ, ET APPAREIL ÉLECTRONIQUE
(JA) 回路基板、回路モジュール、及び電子機器
要約
(EN)
Provided is a thin compact circuit board that has a function to block the entrance of noises into internal electronic components and that further has an enhanced robustness against external stresses as well as a high reliability. A circuit board (1), which is shaped in a thin rectangular parallelepiped, comprises a substrate (2), a recess (3), electronic components (4), groves (5), electrodes (6), an insulative resin (7) and a conductive resin (8). The conductive resin (8) is connected to an electrode (6B) within each grove (5), so that even if external stress is added to the circuit board surface, the stress to the interface between the conductive resin (8) and the electrode (6B) within the substrate (2) can be reduced, thereby allowing the electric connection to have an enhanced tolerance to the external stress. Further, since the conductive resin (8) enters into the groves (5), the connection between the substrate (2) and the conductive resin (8) can be enhanced.
(FR)
L'invention a pour objectif de réaliser une carte de circuit imprimé qui possède une fonction de protection de composants électroniques intégrés contre le bruit, et qui présente une résistance aux contraintes extérieures renforcée et une fiabilité élevée pour une carte de circuit imprimé adaptée à des modèles fins ou petits. La carte de circuit imprimé (1) a la forme d'un parallélépipède de fine épaisseur, et est équipée : d'un matériau de base (2), d'une partie en creux (3), de composants électroniques (4), d'une rainure (5), d'électrodes (6), d'une résine isolante (7), et d'une résine conductrice (8). La connexion de la résine conductrice (8) avec une électrode (6B) s'opérant dans la partie interne de la rainure (5), et les contraintes sur la surface de connexion de l'électrode (6B) avec la résine conductrice (8) qui se trouve dans la partie interne étant réduites même lorsque des contraintes extérieures sont exercées sur la surface de la carte de circuit imprimé, une connexion électrique puissante peut être obtenue face aux contraintes extérieures. En outre, la pénétration de la résine conductrice (8) dans la partie interne de la rainure (5), permet une forte connexion du matériau de base (2) avec la résine conductrice (8).
(JA)
 本発明の課題は、内包した電子部品へのノイズ遮断機能をもち、薄型・小型対応な回路基板に対し、外部応力への耐性を強めた信頼性の高い回路基板を提供することである。 回路基板(1)は厚さが薄い直方体形状を有するものであって、基材(2)と、凹部(3)と、電子部品(4)と、溝(5)と、電極(6)と、絶縁性樹脂(7)と、導電性樹脂(8)、とを備えており、導電性樹脂(8)と電極(6B)との接続を溝(5)の内部で行っているので、回路基板表面へ外部応力が加わったとしても基材(2)の内部にある電極(6B)と導電性樹脂(8)との接続面への応力は緩和されるので、外部応力に強い電気接続が得られる。また、溝(5)の内部に導電性樹脂(8)が入るので、基材(2)と導電性樹脂(8)の接続を強固なものとすることができる。
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