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1. WO2011067919 - 部品実装装置および部品実装装置における基板搬送方法

公開番号 WO/2011/067919
公開日 09.06.2011
国際出願番号 PCT/JP2010/006957
国際出願日 29.11.2010
IPC
H05K 13/02 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
13電気部品の組立体の製造または調整に特に適した装置または方法
02部品の供給
CPC
H05K 13/0061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
H05K 13/08
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
Y10T 29/4913
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49117Conductor or circuit manufacturing
49124On flat or curved insulated base, e.g., printed circuit, etc.
4913Assembling to base an electrical component, e.g., capacitor, etc.
Y10T 29/53174
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
Y10T 29/53265
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53265with work-holder for assembly
出願人
  • パナソニック株式会社 Panasonic Corporation [JP]/[JP] (AllExceptUS)
  • 川瀬 健之 KAWASE, Takeyuki (UsOnly)
  • 北川 貴之 KITAGAWA, Yoshiyuki (UsOnly)
  • 八木 周蔵 YAGI, Shuzo (UsOnly)
発明者
  • 川瀬 健之 KAWASE, Takeyuki
  • 北川 貴之 KITAGAWA, Yoshiyuki
  • 八木 周蔵 YAGI, Shuzo
代理人
  • 小栗 昌平 OGURI, Shohei
優先権情報
2009-27306801.12.2009JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS
(FR) APPAREIL DE MONTAGE DE COMPOSANTS ET PROCÉDÉ DE TRANSPORT DE SUBSTRAT DANS UN APPAREIL DE MONTAGE DE COMPOSANTS
(JA) 部品実装装置および部品実装装置における基板搬送方法
要約
(EN)
Disclosed is a component mounting apparatus equipped with a plurality of substrate conveying lanes that is capable of improving productivity by reasonably controlling the order in which substrates are conveyed. Also disclosed is a substrate conveyance method in the component mounting apparatus. In a configuration in which component supply units (20A, 20B) are disposed on the sides of a conveyor line comprising conveyors (10A, 10B, 10C, and 10D) arranged in parallel and in which a substrate sorting unit (M3B) that sorts substrates (13) transferred from the upstream end of the apparatus is provided, a new substrate (13) is conveyed to the conveyor (10D) closer to the component supply unit (20B) in cases in which a substrate request signal (R) has been output from conveyors (10B, 10C) that are farther from the component supply units (20A, 20B) if a substrate request signal (R) has been output for the conveyor (10D) before the transfer operation for said new substrate (13) is initiated. As a result, the substrates can be conveyed by prioritizing the conveyors that are favorable to increasing the mounting efficiency of components.
(FR)
L'invention porte sur un appareil de montage de composants comportant une pluralité de couloirs de transport de substrats qui est capable d'améliorer la productivité en commandant raisonnablement l'ordre dans lequel les substrats sont transportés. L'invention porte aussi sur un procédé de transport de substrats mis en œuvre dans l'appareil de montage de composants. Dans une configuration dans laquelle des unités d'amenée de composants (20A, 20B) sont disposées sur les côtés d'une ligne de transport comprenant des transporteurs (10A, 10B, 10C et 10D) disposés en parallèle, et dans laquelle est prévue une unité de tri des substrats (M3B) qui trie les substrats (13) transférés de l'extrémité amont de l'appareil, un nouveau substrat (13) est transporté jusqu'au transporteur (10D) le plus rapproché de l'unité d'amenée de composants (20B) dans les cas où un signal de demande de substrat (B) a été émis en provenance des transporteurs (10B, 10C) qui sont plus éloignés des unités d'amenée des composants (20A, 20B) si un signal de demande de substrat (R) a été émis pour le transporteur (10D) avant que l'opération de transfert pour ledit nouveau substrat (13) soit déclenchée. Le résultat est que les substrats peuvent être transportés en donnant la priorité aux transporteurs qui sont favorables afin d'augmenter le rendement de montage de composants.
(JA)
 本発明の課題は、複数の基板搬送レーンを備えた構成において、基板搬入順序を合理的に制御して生産性を向上させることができる部品実装装置および部品実装装置における基板搬送方法を提供することである。 コンベア(10A,10B,10C,10D)を並列して成るコンベア列の側方に部品供給部(20A,20B)が配設され、上流側装置から受け渡された基板(13)を振り分ける基板振り分け部(M3B)とを備えた構成において、部品供給部(20A,20B)から遠い方のコンベア(10B,10C)から基板要求信号(R)が出力されている場合において、新たな基板(13)の乗り移り動作の開始前に、部品供給部(20B)に近い方のコンベア(10D)について基板要求信号Rが出力されたならば、コンベア(10D)に当該新たな基板(13)を搬入させる。これにより、部品実装効率上有利な方のコンベアに優先して基板を搬入することができる。
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