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1. WO2010073744 - キャリア付金属箔

公開番号 WO/2010/073744
公開日 01.07.2010
国際出願番号 PCT/JP2009/054481
国際出願日 10.03.2009
予備審査請求日 12.08.2009
IPC
B32B 15/20 2006.01
B処理操作;運輸
32積層体
B積層体,すなわち平らなまたは平らでない形状,例.細胞状またはハニカム状,の層から組立てられた製品
15本質的に金属からなる積層体
20アルミニウムまたは銅からなるもの
H05K 1/09 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
09金属パターンのための材料の使用
CPC
H05K 2203/0152
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0147Carriers and holders
0152Temporary metallic carrier, e.g. for transferring material
H05K 2203/0285
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
0285Using ultrasound, e.g. for cleaning, soldering or wet treatment
H05K 3/025
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
025by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
H05K 3/4652
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4644by building the multilayer layer by layer, i.e. build-up multilayer circuits
4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Y10T 428/12472
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
12All metal or with adjacent metals
12472Microscopic interfacial wave or roughness
Y10T 428/12736
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
12All metal or with adjacent metals
12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
12736Al-base component
出願人
  • JX日鉱日石金属株式会社 JX Nippon Mining & Metals Corporation [JP]/[JP] (AllExceptUS)
  • 高森 雅之 TAKAMORI, Masayuki [JP]/[JP] (UsOnly)
発明者
  • 高森 雅之 TAKAMORI, Masayuki
代理人
  • 小越 勇 OGOSHI, Isamu
優先権情報
2008-32744824.12.2008JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) METAL FOIL WITH CARRIER
(FR) FEUILLE MÉTALLIQUE AVEC SUPPORT
(JA) キャリア付金属箔
要約
(EN)
A metal foil with a carrier formed by laminating a carrier (A) and a metal foil (B) alternately and characterized in having a structure wherein adjoining carriers (A) have an area covering the entire surface of the metal foil (B) and the edge portion of the carrier (A) projects partially or entirely from the metal foil (B). Disclosed is a copper foil with a carrier to be used for production of a single-sided laminate plate or a multilayer laminate plate of two or more layers or an extremely thin coreless substrate to be used in a printed wiring board. In particular, a copper foil with a carrier to be used for production of a laminate plate is disclosed in order to enhance handling performance of a production process of a printed board and to reduce the cost by increasing the yield.
(FR)
L'invention concerne une feuille métallique avec un support formé en stratifiant alternativement un support (A) et une feuille métallique (B) et caractérisé en ce qu'elle a une structure dans laquelle des supports (A) adjacents ont une surface qui couvre la surface entière de la feuille métallique (B) et en ce que la partie de bord du support (A) dépasse partiellement ou entièrement de la feuille métallique (B). L'invention concerne une feuille de cuivre avec un support à utiliser pour produire une plaque stratifiée sur un seul côté ou une plaque stratifiée multicouches de deux couches ou davantage ou un substrat sans cœur extrêmement mince à utiliser dans une carte de circuit imprimé. En particulier, l'invention concerne une feuille de cuivre avec un support à utiliser pour la production d'une plaque stratifiée afin d'améliorer les performances de manipulation d'un procédé de production d'une carte de circuit imprimé et de réduire le coût en augmentant le rendement.
(JA)
 キャリアAと金属箔Bが交互に重なり合う積層体であって、隣接するキャリアAが金属箔Bの全面を覆う面積を有し、かつ当該キャリアAの縁部の一部又は全部が金属箔Bからはみ出す構造を備えていることを特徴とするキャリア付金属箔。プリント配線板に使用される片面若しくは2層以上の多層積層板又は極薄のコアレス基板の製造の際に用いられるキャリア付銅箔に関する。特に、積層板の製造時に使用するキャリア付き銅箔に係り、その目的とするのはプリント基板製造工程のハンドリング性向上及び歩留りアップによるコスト削減を実現することを課題とする。
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