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1. WO2010073525 - 熱輸送デバイスの製造方法及び熱輸送デバイス

公開番号 WO/2010/073525
公開日 01.07.2010
国際出願番号 PCT/JP2009/006816
国際出願日 11.12.2009
IPC
F28D 15/02 2006.01
F機械工学;照明;加熱;武器;爆破
28熱交換一般
D熱交換媒体が直接接触しない熱交換装置で,他のサブクラスに分類されないもの;蓄熱プラントまたは装置一般
15閉鎖管中の中間熱伝達媒体が流路壁を通り抜ける熱交換装置
02その中で媒体が凝縮及び蒸発するもの,例.ヒートパイプ
B23K 20/00 2006.01
B処理操作;運輸
23工作機械;他に分類されない金属加工
Kハンダ付またはハンダ離脱;溶接;ハンダ付または溶接によるクラッドまたは被せ金;局部加熱による切断,例.火炎切断:レーザービームによる加工
20加熱するかまたは加熱することなく,衝撃または他の圧力を加えることによる非電気的接合,例.クラッド法または被せ金法
CPC
B23K 20/02
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
02by means of a press ; ; Diffusion bonding
B23K 20/16
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
16with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
B23K 2101/14
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
04Tubular or hollow articles
14Heat exchangers
F28D 15/0233
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0233the conduits having a particular shape, e.g. non-circular cross-section, annular
F28D 15/0283
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0283Means for filling or sealing heat pipes
F28D 15/046
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
04with tubes having a capillary structure
046characterised by the material or the construction of the capillary structure
出願人
  • ソニー株式会社 SONY CORPORATION [JP]/[JP] (AllExceptUS)
  • ソニーケミカル&インフォメーションデバイス株式会社 SONY CHEMICAL & INFORMATION DEVICE CORPORATION [JP]/[JP] (AllExceptUS)
  • 良尊弘幸 RYOSON, Hiroyuki [JP]/[JP] (UsOnly)
  • 谷島孝 YAJIMA, Takashi [JP]/[JP] (UsOnly)
  • 鬼木一直 ONIKI, Kazunao [JP]/[JP] (UsOnly)
  • 河西弘人 KASAI, Hiroto [JP]/[JP] (UsOnly)
  • 平田昂士 HIRATA, Koji [JP]/[JP] (UsOnly)
  • 橋本光生 HASHIMOTO, Mitsuo [JP]/[JP] (UsOnly)
発明者
  • 良尊弘幸 RYOSON, Hiroyuki
  • 谷島孝 YAJIMA, Takashi
  • 鬼木一直 ONIKI, Kazunao
  • 河西弘人 KASAI, Hiroto
  • 平田昂士 HIRATA, Koji
  • 橋本光生 HASHIMOTO, Mitsuo
代理人
  • 大森純一 OMORI, Junichi
優先権情報
2008-32886324.12.2008JP
2009-12737427.05.2009JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) THERMAL TRANSPORT DEVICE PRODUCING METHOD AND THERMAL TRANSPORT DEVICE
(FR) PROCÉDÉ DE PRODUCTION D'UN DISPOSITIF DE TRANSFERT THERMIQUE, ET DISPOSITIF DE TRANSFERT THERMIQUE
(JA) 熱輸送デバイスの製造方法及び熱輸送デバイス
要約
(EN)
Provided is a method for producing a thermal transport device which is inexpensive and can be efficiently produced in a small number of processes. A capillary member (5) having a thickness larger than that of a frame member 2 is placed on an inner surface (11) of a lower plate member (1), and the frame member (2) is subsequently placed on the inner surface (11) of the lower plate member (1).  Further, an upper plate member (3) is placed on the capillary member (5).  A compression amount (G) is provided between the frame member (2) and the upper plate member (3) on the basis of a difference between the thicknesses of the capillary member (5) and the frame member (2).  Accordingly, the lower plate member (1) is diffusion-bonded to the frame member (2), and the upper plate member (3) is diffusion-bonded to the frame member (2).  In this respect, the capillary member (5) is compressed by the compression amount (G).  The capillary member (5) is elastic, so that a part of a pressure (P) is absorbed, and a pressure (P’) smaller than the pressure (P) is applied from the capillary member (5) to the lower plate member (1).  The capillary member (5) is diffusion-bonded to the inner surface (11) of the lower plate member (1) by the pressure (P’).
(FR)
L'invention concerne un procédé de production d'un dispositif de transfert thermique économique et susceptible d'être produit efficacement en un petit nombre de processus. Dans le dispositif selon l'invention, un élément capillaire (5) présentant une épaisseur supérieure à celle d'un élément (2) de cadre est placé sur une surface intérieure (11) d'un élément (1) de plaque inférieure, et l'élément (2) de cadre est ensuite placé sur la surface intérieure (11) de l'élément (1) de plaque inférieure. En outre, un élément (3) de plaque supérieure est placé sur l'élément capillaire (5). Une amplitude (G) de compression est ménagée entre l'élément (2) de cadre et l'élément (3) de plaque supérieure sur la base d'une différence entre les épaisseurs de l'élément capillaire (5) et de l'élément (2) de cadre. Conformément au procédé, l'élément (1) de plaque inférieure est collé par diffusion à l'élément (2) de cadre et l'élément (3) de plaque supérieure est collé par diffusion à l'élément (2) de cadre. À cet effet, l'élément capillaire (5) est comprimé de l'amplitude (G) de compression. L'élément capillaire (5) est élastique, de sorte qu'une partie d'une pression (P) est absorbée et une pression (P') inférieure à la pression (P) est appliquée à partir de l'élément capillaire (5) à l'élément (1) de plaque inférieure. L'élément capillaire (5) est collé par diffusion à la surface intérieure (11) de l'élément (1) de plaque inférieure par la pression (P').
(JA)
【課題】少ない工程により効率的に製造される、安価な熱輸送デバイスの製造方法を提供すること。 【解決手段】下板部材1の内面11に、フレーム部材2の厚みより大きい厚みでなる毛細管部材5が載置される。続いて下板部材1の内面11上に、フレーム部材2が載置され、また、毛細管部材5上に上板部材3が載置される。毛細管部材5の厚みとフレーム部材2の厚みとの差により、フレーム部材2と上板部材3との間に、押しつぶし量Gが設けられる。そして下板部材1とフレーム部材2、及び上板部材3とフレーム部材2とが拡散接合される。このとき毛細管部材5は押しつぶし量G分圧縮される。毛細管部材5は弾性を有しているので、圧力Pの一部が吸収され、その圧力Pよりも小さい圧力P´が、毛細管部材5から下板部材1へ加えられる。この圧力P´により、下板部材1の内面11と毛細管部材5とが拡散接合される。
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