処理中

しばらくお待ちください...

設定

設定

出願の表示

1. WO2010067854 - 2層フレキシブル銅張積層基材及びその製造方法

公開番号 WO/2010/067854
公開日 17.06.2010
国際出願番号 PCT/JP2009/070720
国際出願日 04.12.2009
IPC
C23C 18/18 2006.01
C化学;冶金
23金属質材料への被覆;金属質材料による材料への被覆;化学的表面処理;金属質材料の拡散処理;真空蒸着,スパッタリング,イオン注入法,または化学蒸着による被覆一般;金属質材料の防食または鉱皮の抑制一般
C金属質への被覆;金属材料による材料への被覆;表面への拡散,化学的変換または置換による,金属材料の表面処理;真空蒸着,スパッタリング,イオン注入法または化学蒸着による被覆一般
18液状化合物または溶液のいずれかからなる被覆形成化合物の分解による化学的被覆であって表面材料の反応生成物を被覆層中に残さないもの;接触メッキ
16還元または置換によるもの,例.無電解メッキ
18被覆される材料の前処理
C25D 3/38 2006.01
C化学;冶金
25電気分解または電気泳動方法;そのための装置
D電気分解または電気泳動による被覆方法;電鋳;電気分解による加工品の接合;そのための装置
3電気鍍金;そのための鍍金浴
02溶液から
38
C25D 7/00 2006.01
C化学;冶金
25電気分解または電気泳動方法;そのための装置
D電気分解または電気泳動による被覆方法;電鋳;電気分解による加工品の接合;そのための装置
7被覆される物品に特徴のある電気鍍金
CPC
C23C 18/1601
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
C23C 18/1653
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
C23C 18/18
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
C23C 18/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
30Activating ; or accelerating or sensitising with palladium or other noble metal
C23C 18/32
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
C23C 18/50
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
48Coating with alloys
50with alloys based on iron, cobalt or nickel
出願人
  • 荏原ユージライト株式会社 EBARA-UDYLITE CO., LTD. [JP]/[JP] (AllExceptUS)
  • 大野晃宜 OHNO, Akinobu [JP]/[JP] (UsOnly)
  • 高徳誠 KOHTOKU, Makoto [JP]/[JP] (UsOnly)
  • 濱田実香 HAMADA, Mika [JP]/[JP] (UsOnly)
発明者
  • 大野晃宜 OHNO, Akinobu
  • 高徳誠 KOHTOKU, Makoto
  • 濱田実香 HAMADA, Mika
代理人
  • 中村静男 NAKAMURA, Shizuo
優先権情報
2008-31170408.12.2008JP
2009-02263603.02.2009JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) TWO-LAYER FLEXIBLE COPPER-CLAD LAMINATE SUBSTRATE AND PROCESS FOR PRODUCING SAME
(FR) SUBSTRAT STRATIFIÉ CUIVRÉ FLEXIBLE BICOUCHE ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) 2層フレキシブル銅張積層基材及びその製造方法
要約
(EN)
A process for producing a two-layer flexible copper-clad laminate substrate by wet plating using an acidic copper plating bath composition and a resin film coated with a conductive metal serving as a seed layer. The process for two-layer FCCL production includes: a step in which a seed layer is formed by electroless nickel plating on a hydrophilized surface of a resin film; and a step in which this resin film is subjected, without performing primary copper plating, to wet electroplating in the acidic copper plating bath composition to thickly deposit a conductive copper layer on the seed layer.
(FR)
La présente invention concerne un procédé de préparation d'un substrat stratifié cuivré flexible bicouche obtenu par placage humide dans un bain acide de dépôt de cuivre d'un film de résine recouvert d'un métal conducteur servant de couche d'ensemencement. Le procédé comprend une étape selon laquelle une couche d'ensemencement est formée par dépôt de nickel sans courant sur une surface rendue hydrophile d'un film de résine, et une étape selon laquelle ce film de résine est soumis, sans effectuer de dépôt primaire de cuivre, à un placage électrolytique humide dans le bain acide de dépôt de cuivre pour obtenir une couche épaisse de cuivre conducteur sur la couche d'ensemencement.
(JA)
 酸性銅めっき浴組成物とシード層なる導電性金属被覆樹脂フィルムとを用いて、湿式めっき法による2層FCCL の製造方法であって、親水化表面改質を施した樹脂フィルム面に、無電解ニッケルめっきシード層を形成させる工程 と、この酸性銅めっき浴組成物中で、1次銅めっきを介さずに湿式電気めっきを施し、シード層上に銅導電層を厚付 けめっきさせる工程とを含む2層フレキシブル銅張積層基材の製造方法である。
国際事務局に記録されている最新の書誌情報