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1. WO2010061966 - 発光装置およびその製造方法

公開番号 WO/2010/061966
公開日 03.06.2010
国際出願番号 PCT/JP2009/070277
国際出願日 26.11.2009
IPC
H05B 33/22 2006.01
H電気
05他に分類されない電気技術
B電気加熱;他に分類されない電気照明
33エレクトロルミネッセンス光源
12実質的に2次元放射面をもつ光源
22補助的な誘電体または反射層の配置あるいは化学的または物理的組成によって特徴づけられたもの
H01L 51/50 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
51能動部分として有機材料を用い,または能動部分として有機材料と他の材料との組み合わせを用いる固体装置;このような装置またはその部品の製造または処理に特に適用される方法または装置
50光放出に特に適用されるもの,例.有機発光ダイオード(OLED)または高分子発光ダイオード(PLED)
H05B 33/10 2006.01
H電気
05他に分類されない電気技術
B電気加熱;他に分類されない電気照明
33エレクトロルミネッセンス光源
10エレクトロルミネッセンス光源の製造に特に適用する装置または方法
H05B 33/12 2006.01
H電気
05他に分類されない電気技術
B電気加熱;他に分類されない電気照明
33エレクトロルミネッセンス光源
12実質的に2次元放射面をもつ光源
CPC
H01L 27/3246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3246Pixel defining structures, e.g. banks
H01L 27/3283
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3281Passive matrix displays
3283including banks or shadow masks
H01L 51/0004
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0003using liquid deposition, e.g. spin coating
0004using printing techniques, e.g. ink-jet printing, screen printing
H01L 51/0005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0003using liquid deposition, e.g. spin coating
0004using printing techniques, e.g. ink-jet printing, screen printing
0005ink-jet printing
H05B 33/10
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H05B 33/22
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
12Light sources with substantially two-dimensional radiating surfaces
22characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
出願人
  • 住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP]/[JP] (AllExceptUS)
  • 栗原直 KURIHARA, Takashi [JP]/[JP] (UsOnly)
  • 西岡幸也 NISHIOKA, Yukiya [JP]/[JP] (UsOnly)
  • 梶谷優 KAJITANI, Masaru [JP]/[JP] (UsOnly)
  • 藤澤拓司 FUJISAWA, Takuji [JP]/[JP] (UsOnly)
  • 赤津光俊 AKATSU, Mitsutoshi [JP]/[JP] (UsOnly)
  • 雨宮聡 AMAMIYA, Satoshi [JP]/[JP] (UsOnly)
発明者
  • 栗原直 KURIHARA, Takashi
  • 西岡幸也 NISHIOKA, Yukiya
  • 梶谷優 KAJITANI, Masaru
  • 藤澤拓司 FUJISAWA, Takuji
  • 赤津光俊 AKATSU, Mitsutoshi
  • 雨宮聡 AMAMIYA, Satoshi
代理人
  • 中山亨 NAKAYAMA, Tohru
優先権情報
2008-30386428.11.2008JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) LIGHT EMISSION DEVICE AND METHOD FOR MANUFACTURING SAME
(FR) DISPOSITIF PHOTOÉMETTEUR ET SON PROCÉDÉ DE FABRICATION
(JA) 発光装置およびその製造方法
要約
(EN)
Provided is a light emission device including: a substrate; a plurality of Organic Electro-Luminescence elements arranged on the substrate; and a partition which defines each of the pixel regions where the Organic Electro-Luminescence elements are arranged. The partition includes: an insulation film having holes at regions corresponding to the respective pixel regions; and a partition main body arranged at the side opposite to the substrate side of the insulation film. The organic EL element includes: a pair of electrodes; and a light emission unit arranged at a region sandwiched by the electrodes and surrounded by the insulation film. The insulation film has a thickness smaller than that of the light emission unit.
(FR)
L'invention concerne un dispositif photoémetteur comprenant: un substrat; plusieurs éléments électroluminescents organiques disposés sur le substrat; et une cloison délimitant chacune des zones de pixels où sont disposés les éléments électroluminescents organiques. La cloison comporte un film isolant percé de trous correspondant aux différentes zones de pixels, et un corps principal placé du côté opposé au côté substrat du film isolant. Un élément électroluminescent organique comprend: une paire d'électrodes; et une unité photoémettrice placée entre les électrodes et entourée par le film isolant dont l'épaisseur est inférieure à celle de l'unité photoémettrice.
(JA)
基板と、該基板上に設けられる複数の有機エレクトロルミネッセンス素子と、各有機EL素子が設けられる各画素領域を規定する隔壁とを備える発光装置であって、前記隔壁は、前記各画素領域に相当する領域に穴が穿設されてなる絶縁膜と、該絶縁膜の基板側とは反対側に設けられる隔壁本体とを含んで構成され、前記有機EL素子は、一対の電極と、該電極に挟持され、かつ前記絶縁膜に囲まれる領域に配置される発光部とを含んで構成され、前記絶縁膜の厚みが、前記発光部の厚みよりも薄いことを特徴とする。
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