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1. WO2010061433 - 発光素子パッケージ用基板の製造方法および発光素子パッケージ

公開番号 WO/2010/061433
公開日 03.06.2010
国際出願番号 PCT/JP2008/071340
国際出願日 25.11.2008
IPC
H01L 33/00 2010.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
33光の放出に特に適用される少なくとも1つの電位障壁または表面障壁を有する半導体装置;それらの装置またはその部品の製造,あるいは処理に特に適用される方法または装置;それらの装置の細部
CPC
H01L 2224/32188
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32153the body and the item being arranged next to each other, e.g. on a common substrate
32175the item being metallic
32188the layer connector connecting to a bonding area protruding from the surface of the item
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2924/01004
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01004Beryllium [Be]
H01L 2924/01012
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01012Magnesium [Mg]
H01L 2924/01046
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01046Palladium [Pd]
H01L 2924/01057
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01057Lanthanum [La]
出願人
  • 電気化学工業株式会社 DENKI KAGAKU KOGYO KABUSHIKI KAISHA [JP]/[JP] (AllExceptUS)
  • 鈴木 元裕 SUZUKI, Motohiro [JP]/[JP] (UsOnly)
  • 米村 直己 YONEMURA, Naomi [JP]/[JP] (UsOnly)
  • 岡島 芳彦 OKAJIMA, Yoshihiko [JP]/[JP] (UsOnly)
  • 前田 哲郎 MAEDA, Tetsuro [JP]/[JP] (UsOnly)
  • 吉村 栄二 YOSHIMURA, Eiji [JP]/[JP] (UsOnly)
発明者
  • 鈴木 元裕 SUZUKI, Motohiro
  • 米村 直己 YONEMURA, Naomi
  • 岡島 芳彦 OKAJIMA, Yoshihiko
  • 前田 哲郎 MAEDA, Tetsuro
  • 吉村 栄二 YOSHIMURA, Eiji
代理人
  • 特許業務法人 ユニアス国際特許事務所 UNIUS PATENT ATTORNEYS OFFICE
優先権情報
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE
(FR) PROCÉDÉ POUR LA FABRICATION DE SUBSTRAT POUR BOÎTIER D’ÉLÉMENTS ÉLECTROLUMINESCENTS, ET BOÎTIER D’ÉLÉMENTS ÉLECTROLUMINESCENTS
(JA) 発光素子パッケージ用基板の製造方法および発光素子パッケージ
要約
(EN)
Provided is a method for manufacturing a substrate for a light emitting element package. The reduced-size substrate is provided for packaging a light emitting element, and has sufficient dissipation effects of heat from the light emitting element. The substrate can be mass-produced at low cost. A light emitting element package using the substrate manufactured by such method is also provided. The substrate for the light emitting element package is provided with a thick metal portion formed below the mounting position of the light emitting element. The manufacturing method has a laminating step of performing laminating integration, while feeding each of a metal layer member and a metal layer member having the thick metal portion. A laminated body has an insulating adhesive, which is composed of a resin containing a heat conductive filler and has a heat conductivity of 1.0W/mK or higher, and the metal layer member.
(FR)
La présente invention concerne un procédé pour la fabrication de substrat pour un boîtier d’éléments électroluminescents. Le substrat de taille réduite est prévu pour l’encapsulation d’un élément électroluminescent, et présente des effets suffisants de dissipation de la chaleur provenant de l’élément électroluminescent. Le substrat peut être produit en masse à un coût économique. L’invention concerne également un boîtier d’éléments électroluminescents utilisant un substrat fabriqué par un tel procédé. Le substrat pour le boîtier d’éléments électroluminescents est doté d’une partie métallique épaisse formée en-dessous de la position de montage de l’élément électroluminescent. Le procédé de fabrication comprend une étape de stratification pour effectuer une intégration par stratification, tout en alimentant chacun parmi un élément de couche métallique et un élément métallique présentant une partie métallique épaisse. Un corps stratifié présente un adhésif isolant, qui est constitué d’une résine contenant une charge conductrice de chaleur et présente une conductivité thermique égale ou supérieure à 1,0 W/mK, et l’élément de couche métallique.
(JA)
 発光素子のパッケージ化のための基板として、発光素子から十分な放熱効果が得られ、大量生産、低コスト化や小型化が可能な発光素子パッケージ用基板の製造方法、およびこの製造方法で製造された発光素子パッケージ用基板を用いた発光素子パッケージを提供することにある。発光素子の実装位置下方に形成される金属肉厚部を備える発光素子パッケージ用基板の製造方法であって、熱伝導性フィラーを含む樹脂から構成された1.0W/mK以上の熱伝導率を有する絶縁接着剤および金属層部材を有する積層体と、金属肉厚部を有する金属層部材との、それぞれの部材を繰り出しながら、積層一体化する積層工程を有する。
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