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1. WO2009041300 - 熱伝導性シート及びパワーモジュール

公開番号 WO/2009/041300
公開日 02.04.2009
国際出願番号 PCT/JP2008/066551
国際出願日 12.09.2008
IPC
H01L 23/373 2006.1
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
36冷却または加熱を容易にするための材料の選択または成形,例.ヒート・シンク
373装置用材料の選択により容易になる冷却
CPC
F28F 2013/006
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
13Arrangements for modifying heat-transfer, e.g. increasing, decreasing
005Thermal joints
006Heat conductive materials
H01L 2224/2929
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
29198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
29199Material of the matrix
2929with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H01L 2224/29386
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
29198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
29298Fillers
29299Base material
29386with a principal constituent of the material being a non metallic, non metalloid inorganic material
H01L 2224/29499
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
29198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
29298Fillers
29499Shape or distribution of the fillers
H01L 2224/32245
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32245the item being metallic
H01L 2224/451
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
出願人
  • 三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP]/[JP] (AllExceptUS)
  • 三村 研史 MIMURA, Kenji [JP]/[JP] (UsOnly)
  • 瀧川 秀記 TAKIGAWA, Hideki [JP]/[JP] (UsOnly)
  • 塩田 裕基 SHIOTA, Hiroki [JP]/[JP] (UsOnly)
  • 多田 和弘 TADA, Kazuhiro [JP]/[JP] (UsOnly)
  • 西村 隆 NISHIMURA, Takashi [JP]/[JP] (UsOnly)
  • 伊藤 浩美 ITO, Hiromi [JP]/[JP] (UsOnly)
  • 平松 星紀 HIRAMATSU, Seiki [JP]/[JP] (UsOnly)
  • 藤野 敦子 FUJINO, Atsuko [JP]/[JP] (UsOnly)
  • 山本 圭 YAMAMOTO, Kei [JP]/[JP] (UsOnly)
  • 正木 元基 MASAKI, Motoki [JP]/[JP] (UsOnly)
発明者
  • 三村 研史 MIMURA, Kenji
  • 瀧川 秀記 TAKIGAWA, Hideki
  • 塩田 裕基 SHIOTA, Hiroki
  • 多田 和弘 TADA, Kazuhiro
  • 西村 隆 NISHIMURA, Takashi
  • 伊藤 浩美 ITO, Hiromi
  • 平松 星紀 HIRAMATSU, Seiki
  • 藤野 敦子 FUJINO, Atsuko
  • 山本 圭 YAMAMOTO, Kei
  • 正木 元基 MASAKI, Motoki
代理人
  • 曾我 道治 SOGA, Michiharu
優先権情報
2007-24892726.09.2007JP
2007-24893626.09.2007JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) HEAT CONDUCTIVE SHEET AND POWER MODULE
(FR) FEUILLE THERMO-CONDUCTRICE ET MODULE DE PUISSANCE
(JA) 熱伝導性シート及びパワーモジュール
要約
(EN) A heat conductive sheet comprising an inorganic filler which is dispersed in a thermosetting resin, characterized in that the inorganic filler contains secondary aggregation particles formed by isotropically aggregating flaky boron nitride primary particles having an average major diameter of 15 &mgr;m or less and the inorganic filler contains more than 20% by volume of the secondary aggregation particles as described above that have a particle diameter of 50 &mgr;m or more. This heat conductive sheet is advantageous from the standpoints of productivity and cost and excellent in heat conductivity and electrical insulating properties.
(FR) L'invention concerne une feuille thermo-conductrice comprenant un agent de remplissage inorganique qui est dispersé dans une résine thermodurcissable, caractérisée en ce que l'agent de remplissage inorganique contient des particules d'agrégation secondaires formées par l'agrégation isotrope de particules de nitrure de bore primaires lamellaires ayant un diamètre majeur moyen de 15 µm ou moins et l'agent de remplissage inorganique contient plus de 20 % en volume des particules d'agrégation secondaires telles que décrites ci-dessus qui ont un diamètre de particule de 50 µm ou plus. Cette feuille thermo-conductrice est avantageuse du point de vue de la productivité et du coût et présente une excellente conductivité thermique et d'excellentes propriétés d'isolement électrique.
(JA)  本発明は、無機充填剤を熱硬化性樹脂中に分散してなる熱伝導性シートであって、前記無機充填剤が、15μm以下の平均長径を有する鱗片状窒化ホウ素の一次粒子を等方的に凝集させて形成した二次凝集粒子を含み、且つ前記無機充填剤が、50μm以上の粒径を有する前記二次凝集粒子を20体積%より多く含むことを特徴とする熱伝導性シートである。この熱伝導性シートは、生産性やコスト面において有利であり、且つ熱伝導性及び電気絶縁性に優れている。
関連特許文献
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