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1. WO2007108477 - 基板支持具、基板処理ユニットおよび基板支持方法

公開番号 WO/2007/108477
公開日 27.09.2007
国際出願番号 PCT/JP2007/055708
国際出願日 20.03.2007
予備審査請求日 22.01.2008
IPC
H01L 21/683 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
67製造または処理中の半導体または電気的固体装置の取扱いに特に適用される装置;半導体または電気的固体装置もしくは構成部品の製造または処理中のウエハの取扱いに特に適用される装置
683支持または把持のためのもの
H01L 21/304 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
18不純物,例.ドーピング材料,を含むまたは含まない周期表第IV族の元素またはA↓I↓I↓IB↓V化合物から成る半導体本体を有する装置
30H01L21/20~H01L21/26に分類されない方法または装置を用いる半導体本体の処理
302表面の物理的性質または形状を変換するため,例.エッチング,ポリシング,切断
304機械的処理,例.研摩,ポリシング,切断
CPC
H01L 21/67057
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67057with the semiconductor substrates being dipped in baths or vessels
H01L 21/67316
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
67313Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
67316characterized by a material, a roughness, a coating or the like
H01L 21/6733
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
6733characterized by a material, a roughness, a coating or the like
H01L 21/67757
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67757vertical transfer of a batch of workpieces
出願人
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 〒1078481 東京都港区赤坂五丁目3番6号 Tokyo 3-6, Akasaka 5-chome, Minato-ku, Tokyo 1078481, JP (AllExceptUS)
  • 上村 史洋 KAMIMURA, Fumihiro [JP/JP]; JP (UsOnly)
  • 津田 修 TSUDA, Osamu [JP/JP]; JP (UsOnly)
発明者
  • 上村 史洋 KAMIMURA, Fumihiro; JP
  • 津田 修 TSUDA, Osamu; JP
代理人
  • 吉武 賢次 YOSHITAKE, Kenji; 〒1000005 東京都千代田区丸の内三丁目2番3号 富士ビル323号 協和特許法律事務所 Tokyo Kyowa Patent & Law Office Room 323, Fuji Bldg. 2-3, Marunouchi 3-chome Chiyoda-ku, Tokyo 1000005, JP
優先権情報
2006-07995523.03.2006JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SUBSTRATE SUPPORT, SUBSTRATE PROCESSING UNIT AND SUBSTRATE SUPPORTING METHOD
(FR) SUPPORT DE SUBSTRAT, MODULE DE TRAITEMENT DE SUBSTRAT ET PROCEDE DE SUPPORT DE SUBSTRAT
(JA) 基板支持具、基板処理ユニットおよび基板支持方法
要約
(EN)
A substrate support (36) is provided with an arm (37), which extends in a vertical direction and can be lifted at least in the vertical direction; supporting bodies (38, 39, 40, 41), which are arranged to extend in the horizontal direction from the arm (37) and have supporting grooves (44, 45, 46, 47) for supporting a substrate (2) at prescribed intervals along the horizontal direction; and a shielding body (49) which is arranged to face the substrate closest to the arm (37) among a plurality of substrates (2) to be supported by the supporting bodies (38, 39, 40, 41). A shielding surface (52), which is formed by the shielding body (49) and the arm (37) and faces the substrate (2) closest to the arm (37), has the same shape as the surface of the substrate (2) or wider than the surface of the substrate (2). The shielding body (49) is composed of a material having a specific heat higher than that of the substrate (2).
(FR)
Support de substrat (36) comprenant un bras (37), qui s'étend dans une direction verticale et qui peut être levé au moins dans la direction verticale ; des corps de support (38, 39, 40, 41) agencés pour s'étendre dans la direction horizontale à partir du bras (37) et comportant des rainures de support (44, 45, 46, 47) pour supporter un substrat (2) à des intervalles définis le long de la direction horizontale ; et un corps de protection (49) agencé pour faire face au substrat le plus près du bras (37) parmi une pluralité de substrats (2) supportés par les corps de support (38, 39, 40, 41). Une surface de protection (52) qui est formée par le corps de protection (49) et le bras (37) et qui fait face au substrat (2) le plus près du bras (37) a la même forme que la surface du substrat (2) ou est plus large que la surface du substrat (2). Le corps de protection (49) est composé d'un matériau ayant une chaleur spécifique supérieure à celle du substrat (2).
(JA)
not available
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