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1. WO2007108470 - 基板処理装置システム

公開番号 WO/2007/108470
公開日 27.09.2007
国際出願番号 PCT/JP2007/055678
国際出願日 20.03.2007
IPC
H01L 21/02 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
CPC
G05B 19/41875
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
19Programme-control systems
02electric
418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
41875characterised by quality surveillance of production
G05B 2219/45031
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
2219Program-control systems
30Nc systems
45Nc applications
45031Manufacturing semiconductor wafers
H01L 21/67276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67276Production flow monitoring, e.g. for increasing throughput
H01L 21/67769
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67769Storage means
H01L 21/67772
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67772involving removal of lid, door, cover
Y02P 90/22
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
90Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
22characterised by quality surveillance of production
出願人
  • 株式会社日立国際電気 HITACHI KOKUSAI ELECTRIC INC. [JP/JP]; 〒1018980 東京都千代田区外神田四丁目14番1号 Tokyo 14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo 1018980, JP (AllExceptUS)
  • 小山 良崇 KOYAMA, Yoshitaka [JP/JP]; JP (UsOnly)
発明者
  • 小山 良崇 KOYAMA, Yoshitaka; JP
代理人
  • 特許業務法人 アイ・ピー・エス PATENT RELATED CORPORATION IPS; 〒2210052 神奈川県横浜市神奈川区栄町5番地1 横浜クリエーションスクエア15階 Kanagawa 15F., Yokohama Creation Square 5-1, Sakaecho, Kanagawa-ku, Yokohama-shi, Kanagawa 2210052, JP
優先権情報
2006-08115323.03.2006JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SUBSTRATE PROCESSING DEVICE SYSTEM
(FR) SYSTEME DE DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置システム
要約
(EN)
A substrate processing system is provided to easily make use of collecting data transmitted by a substrate processing device. In a substrate processing system comprised of a substrate processing device and a group management device connected with the substrate processing device, the group management device is provided with an accumulating means for accumulating collecting data transmitted from the substrate processing device (100), a storing means for storing hardware information for components of the substrate processing device and item title information set in advance in association with the hardware information, and a memory means for memorizing the hardware information and the collecting data transmitted from the substrate processing device in association with the hardware information.
(FR)
La présente invention concerne un système de traitement de substrat pour utiliser facilement la collecte de données transmises par un dispositif de traitement de substrat. Dans un système de traitement de substrat composé d'un dispositif de traitement de substrat et d'un dispositif de gestion de groupe connecté au dispositif de traitement de substrat, le dispositif de gestion de groupe est muni d'un moyen d'accumulation pour accumuler la collecte de données transmises du dispositif de traitement du substrat (100), un moyen de stockage pour stocker des informations de matériel pour les composants du dispositif de traitement du substrat et des informations de titre d'article établies à l'avance en association avec les informations de matériel, ainsi qu'un moyen de mémoire pour mémoriser les informations de matériel et la collecte de données transmises du dispositif de traitement du substrat en association avec les informations de matériel.
(JA)
基板処理装置より送信される収集データを容易に活用することができる基板処理システムを提供する。基板処理装置と、基板処理装置に接続される群管理装置とで構成される基板処理システムにおいて、群管理装置は、基板処理装置100から送信される収集データを蓄積する蓄積手段と、基板処理装置を構成する部品のハードウエア情報と予め設定された項目名称情報とを関連付けて格納する格納手段と、ハードウエア情報と基板処理装置から送信される収集データとを関連付けて記憶する記憶部とを有する。
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