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1. WO2007108351 - 無電解メッキ形成材料、およびこれを用いた無電解メッキの形成方法

公開番号 WO/2007/108351
公開日 27.09.2007
国際出願番号 PCT/JP2007/054848
国際出願日 12.03.2007
IPC
C23C 18/20 2006.01
C化学;冶金
23金属質材料への被覆;金属質材料による材料への被覆;化学的表面処理;金属質材料の拡散処理;真空蒸着,スパッタリング,イオン注入法,または化学蒸着による被覆一般;金属質材料の防食または鉱皮の抑制一般
C金属質への被覆;金属材料による材料への被覆;表面への拡散,化学的変換または置換による,金属材料の表面処理;真空蒸着,スパッタリング,イオン注入法または化学蒸着による被覆一般
18液状化合物または溶液のいずれかからなる被覆形成化合物の分解による化学的被覆であって表面材料の反応生成物を被覆層中に残さないもの;接触メッキ
16還元または置換によるもの,例.無電解メッキ
18被覆される材料の前処理
20有機質表面の前処理,例.樹脂
CPC
C23C 18/1608
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1603coating on selected surface areas
1607by direct patterning
1608from pretreatment step, i.e. selective pre-treatment
C23C 18/1653
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
C23C 18/1893
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1851of surfaces of non-metallic or semiconducting in organic material
1872by chemical pretreatment
1886Multistep pretreatment
1893with use of organic or inorganic compounds other than metals, first
C23C 18/2086
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
2006by other methods than those of C23C18/22 - C23C18/30
2046by chemical pretreatment
2073Multistep pretreatment
2086with use of organic or inorganic compounds other than metals, first
C23C 18/285
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
285Sensitising or activating with tin based compound or composition
C23C 18/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
30Activating ; or accelerating or sensitising with palladium or other noble metal
出願人
  • 株式会社きもと KIMOTO CO., LTD. [JP/JP]; 〒1600022 東京都新宿区新宿二丁目19番1号 Tokyo 19-1, Shinjuku 2-chome, Shinjuku-ku, Tokyo 1600022, JP (AllExceptUS)
  • 株式会社関東学院大学表面工学研究所 KANTO GAKUIN UNIVERSITY SURFACE ENGINEERING RESEARCH INSTITUTE [JP/JP]; 〒2390806 神奈川県横須賀市池田町4丁目4番1号 Kanagawa 4-1, Ikeda-cho 4-chome, Yokosuka-shi, Kanagawa 2390806, JP (AllExceptUS)
  • 太田 哲司 OHTA, Tetsuji [JP/JP]; JP (UsOnly)
  • 渡辺 充広 WATANABE, Mitsuhiro [JP/JP]; JP (UsOnly)
発明者
  • 太田 哲司 OHTA, Tetsuji; JP
  • 渡辺 充広 WATANABE, Mitsuhiro; JP
代理人
  • 多田 公子 TADA, Kimiko; 〒1000013 東京都千代田区霞が関3丁目6番15号 グローリアビル9F Tokyo Gloria Building 9F 6-15, Kasumigaseki 3-chome Chiyoda-ku, Tokyo 1000013, JP
優先権情報
2006-08094223.03.2006JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) MATERIAL TO BE PLATED BY ELECTROLESS PLATING AND METHOD OF ELECTROLESS PLATING ON THE SAME
(FR) MATERIAU DESTINE A ETRE PLAQUE PAR PLACAGE ANELECTROLYTIQUE ET PROCEDE DE PLACAGE ANELECTROLYTIQUE DE CE MATERIAU
(JA) 無電解メッキ形成材料、およびこれを用いた無電解メッキの形成方法
要約
(EN)
A material to be plated by electroless plating which has satisfactory catalyst adhesion and in which the catalyst adhesion layer does not peel off the nonconductive base in a catalyst adhesion step, a development step, and other step(s). The material to be plated by electroless plating comprises a nonconductive base and a catalyst adhesion layer formed thereover, wherein the catalyst adhesion layer is made of a hydrophilic and/or water-soluble resin having hydroxy groups and a cured layer formed from a hydroxylated resin and an isocyanate compound is disposed between the base and the catalyst adhesion layer. Preferably, the catalyst adhesion layer is formed while the isocyanate group of the isocyanate compound remains in the cured layer.
(FR)
L'invention concerne un matériau destiné à être plaqué par placage anélectrolytique présentant une adhésion satisfaisant à un catalyseur et dans lequel la couche d'adhésion à un catalyseur ne se détache pas de la base non conductrice lors d'une étape d'adhésion du catalyseur, une étape de développement et une ou plusieurs autres étapes. Le matériau à plaquer par placage anélectrolytique comprend une base non conductrice et une couche d'adhésion à un catalyseur formée sur cette base, la couche d'adhésion à un catalyseur étant constituée d'une résine hydrophile et/ou hydrosoluble ayant des groupements hydroxy, une couche durcie formée à partir d'une résine hydroxylée et d'un composé d'isocyanate étant disposée entre la base et la couche d'adhésion à un catalyseur. La couche d'adhésion à un catalyseur est de préférence formée alors que le groupement isocyanate du composé isocyanate reste dans la couche durcie.
(JA)
 触媒付着性が良好であり、また、触媒付着工程、現像工程その他工程において、非導電性基材から触媒付着層が剥離することのない無電解メッキ形成材料を提供する。  非導電性基材上に触媒付着層を有する無電解メッキ形成材料において、前記触媒付着層を水酸基を含有してなる親水性及び/又は水溶性樹脂から形成し、前記基材と前記触媒付着層との間に、水酸基を有する樹脂及びイソシアネート系化合物から形成されてなる硬化層を設置する。好ましくは、前記硬化層中のイソシアネート系化合物のイソシアネート基が残存しているうちに、前記触媒付着層を形成するように構成する。
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