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1. WO2007108087 - 絶縁樹脂層、キャリア付き絶縁樹脂層および多層プリント配線板

公開番号 WO/2007/108087
公開日 27.09.2007
国際出願番号 PCT/JP2006/305548
国際出願日 20.03.2006
IPC
H05K 1/03 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
1印刷回路
02細部
03基体用材料の使用
CPC
H05K 1/024
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0237High frequency adaptations
024Dielectric details, e.g. changing the dielectric material around a transmission line
H05K 1/036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
036Multilayers with layers of different types
H05K 2201/0195
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0183Dielectric layers
0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
H05K 2201/068
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
06Thermal details
068wherein the coefficient of thermal expansion is important
H05K 3/4626
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
4626characterised by the insulating layers or materials
Y10T 428/31504
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
31504Composite [nonstructural laminate]
出願人
  • 住友ベークライト株式会社 SUMITOMO BAKELITE Co., Ltd. [JP/JP]; 〒1400002 東京都品川区東品川2丁目5番8号 Tokyo 5-8, Higashi-Shinagawa 2-chome, Shinagawa-ku, Tokyo 1400002, JP (AllExceptUS)
  • 小野塚 偉師 ONOZUKA, Iji [JP/JP]; JP (UsOnly)
  • 新井 政貴 ARAI, Masataka [JP/JP]; JP (UsOnly)
  • 八月朔日 猛 HOSOMI, Takeshi [JP/JP]; JP (UsOnly)
発明者
  • 小野塚 偉師 ONOZUKA, Iji; JP
  • 新井 政貴 ARAI, Masataka; JP
  • 八月朔日 猛 HOSOMI, Takeshi; JP
代理人
  • 速水 進治 HAYAMI, Shinji; 〒1500021 東京都渋谷区恵比寿西2-17-16 代官山TKビル1階 Tokyo Gotanda TG Bldg. 9F 9-2, Nishi-Gatanda 7-chome Shinagawa-ku, Tokyo 141-0031, JP
優先権情報
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) INSULATING RESIN LAYER, INSULATING RESIN LAYER WITH CARRIER AND MULTILAYER PRINTED WIRING BOARD
(FR) COUCHE DE RÉSINE ISOLANTE, COUCHE DE RÉSINE ISOLANTE SUR UN SUPPORT ET CARTE À CIRCUIT IMPRIMÉ MULTICOUCHE
(JA) 絶縁樹脂層、キャリア付き絶縁樹脂層および多層プリント配線板
要約
(EN)
An insulating resin layer for use in production of a multilayer printed wiring board through hot press molding. There is provided an insulating resin layer having, superimposed one upon another, at least one of each of a first layer and a second layer, characterized in that the first layer after hot press molding has a specific inductive capacity of 3.2 or below at a frequency of 1 MHz, and that the second layer after hot press molding has a linear expansion coefficient of 40 ppm/°C or below at 35° to 85°C. Further, there is provided a multilayer printed wiring board characterized by being obtained by superimposing this insulating resin layer on at least one major surface of inner-layer circuit board and conducting hot press molding thereof.
(FR)
L'invention concerne une couche de résine isolante destinée à être utilisée dans la production d'une carte à circuit imprimé multicouche par pressage à chaud. L'invention concerne une couche de résine isolante ayant, superposées les unes sur les autres, au moins l'une de chacune d'une première couche et d'une seconde couche, caractérisée en ce que la première couche après pressage à chaud a une constante diélectrique inférieure ou égale à 3,2 à une fréquence de 1 MHz et en ce que la seconde couche après pressage à chaud a un coefficient de dilatation linéaire inférieur ou égal à 40 ppm/°C à une température de 35°C à 85°C. En outre, l'invention concerne une carte à circuit imprimé multicouche caractérisée en ce qu'elle est obtenue en superposant cette couche de résine isolante sur au moins une surface principale d'une couche interne de carte de circuit imprimé et en effectuant un pressage à chaud de celles-ci.
(JA)
 加熱加圧成形により多層プリント配線板を形成するのに用いられる絶縁樹脂層であって、第1の層および第2の層がそれぞれ少なくとも一層以上積層されてなり、加熱加圧成形後における前記第1の層の周波数1MHzにおける比誘電率が3.2以下であり、加熱加圧成形後における前記第2の層の35°C以上85°C以下における線膨張係数が40ppm/°C以下である、ことを特徴とする絶縁樹脂層。当該絶縁樹脂層を、内層回路板の少なくとも片面に積層し、加熱加圧成形してなることを特徴とする多層プリント配線板。
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