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1. WO2007105559 - 角速度センサとその製造方法およびその角速度センサを用いた電子機器

公開番号 WO/2007/105559
公開日 20.09.2007
国際出願番号 PCT/JP2007/054428
国際出願日 07.03.2007
IPC
G01C 19/56 2012.01
G物理学
01測定;試験
C距離,水準または方位の測定;測量;航行;ジャイロ計器;写真計量または映像計量
19ジャイロスコープ;振動状態の質量体を用いる回転感知装置;運動状態の質量体を持たない回転感知装置;ジャイロ効果を利用した角速度の測定
56振動状態の質量体を用いる回転感知装置,例.コリオリ力に基づく振動型角速度センサ
CPC
G01C 19/5607
GPHYSICS
01MEASURING; TESTING
CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
19Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
5607using vibrating tuning forks
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H01L 2924/19105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
191Disposition
19101of discrete passive components
19105in a side-by-side arrangement on a common die mounting substrate
出願人
  • 松下電器産業株式会社 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 〒5718501 大阪府門真市大字門真1006番地 Osaka 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501, JP (AllExceptUS)
  • 上田 真二郎 UEDA, Shinjiro; null (UsOnly)
  • 毛利 浩明 MOURI, Hiroaki; null (UsOnly)
  • 中島 耕一郎 NAKASHIMA, Koichiro; null (UsOnly)
発明者
  • 上田 真二郎 UEDA, Shinjiro; null
  • 毛利 浩明 MOURI, Hiroaki; null
  • 中島 耕一郎 NAKASHIMA, Koichiro; null
代理人
  • 岩橋 文雄 IWAHASHI, Fumio; 〒5718501 大阪府門真市大字門真1006番地 松下電器産業株式会社内 Osaka c/o Matsushita Electric Industrial Co., Ltd. 1006, Oaza Kadoma Kadoma-shi Osaka 5718501, JP
優先権情報
2006-07060115.03.2006JP
2006-07060215.03.2006JP
2006-07060315.03.2006JP
2006-07060415.03.2006JP
2006-07060515.03.2006JP
2006-07060615.03.2006JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) ANGULAR VELOCITY SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE USING THE ANGULAR VELOCITY SENSOR
(FR) CAPTEUR DE VITESSE ANGULAIRE, SON PROCEDE DE FABRICATION ET DISPOSITIF ELECTRONIQUE UTILISANT LE CAPTEUR DE VITESSE ANGULAIRE
(JA) 角速度センサとその製造方法およびその角速度センサを用いた電子機器
要約
(EN)
An angular velocity sensor comprises a substrate having an upper surface in which a recess is formed, an electronic part mounted in the recess, and a vibrating element mounted on the upper surface of the substrate. The vibrating element include portions positioned just above the electronic part. The angular velocity sensor can be miniaturized.
(FR)
La présente invention concerne un capteur de vitesse angulaire comprenant un substrat ayant une surface supérieure dans laquelle un renfoncement est formé, une pièce électronique montée dans le renfoncement et un élément vibrant monté sur la surface supérieure du substrat. L'élément vibrant comprend des parties positionnées juste au-dessus de la pièce électronique. Le capteur de vitesse angulaire peut être miniaturisé.
(JA)
 角速度センサは、凹部が形成された上面を有する基板と、その凹部内に実装された電子部品と、前記基板の前記上面に取り付けられた振動素子とを備える。その振動素子は、前記電子部品の真上方に位置する部分を有する。この角速度センサは小型化することができる。
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