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1. WO2007105426 - 半導体装置のリペア方法及び半導体装置のリペア装置

公開番号 WO/2007/105426
公開日 20.09.2007
国際出願番号 PCT/JP2007/053076
国際出願日 20.02.2007
IPC
H01L 21/60 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
50サブグループH01L21/06~H01L21/326の一つに分類されない方法または装置を用いる半導体装置の組立
60動作中の装置にまたは装置から電流を流すためのリードまたは他の導電部材の取り付け
CPC
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 2224/48139
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
48139with an intermediate bond, e.g. continuous wire daisy chain
H01L 2224/48175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48153the body and the item being arranged next to each other, e.g. on a common substrate
48175the item being metallic
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
出願人
  • 株式会社 豊田自動織機 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI [JP/JP]; 〒4488671 愛知県刈谷市豊田町2丁目1番地 Aichi 2-1, Toyoda-cho, Kariya-shi, Aichi 4488671, JP (AllExceptUS)
  • 金原 雅彦 KIMBARA, Masahiko [JP/JP]; JP (UsOnly)
発明者
  • 金原 雅彦 KIMBARA, Masahiko; JP
代理人
  • 恩田 博宣 ONDA, Hironori; 〒5008731 岐阜県岐阜市大宮町2丁目12番地の1 Gifu 12-1, Ohmiya-cho 2-chome Gifu-shi, Gifu 5008731, JP
優先権情報
2006-05382828.02.2006JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) METHOD FOR REPAIRING SEMICONDUCTOR DEVICE AND APPARATUS FOR REPAIRING SEMICONDUCTOR DEVICE
(FR) PROCEDE ET APPAREIL POUR LA REPARATION D'UN COMPOSANT A SEMICONDUCTEUR
(JA) 半導体装置のリペア方法及び半導体装置のリペア装置
要約
(EN)
Disclosed is a method for repairing a semiconductor device which comprises a plurality of semiconductor elements mounted on a circuit board by using a solder. Each semiconductor element is connected to the other semiconductor elements and a wiring portion, which is formed on the circuit board, through a bonding wire. When any one of the semiconductor elements is repaired, firstly the solder is melted by heating the semiconductor element to be removed. Then, the semiconductor element is removed from the circuit board by pulling the bonding wire connected to the semiconductor element while the solder is in a melted state.
(FR)
L'invention concerne un procédé de réparation d'un composant à semiconducteur qui comprend une pluralité d'éléments semiconducteurs montés sur une carte à circuit imprimé en utilisant de la soudure. Chaque élément à semiconducteur est relié aux autres éléments à semiconducteur et à une partie de câblage, laquelle est formée sur la carte à circuit imprimé par l'intermédiaire d'un fil de liaison. Lorsque l'un quelconque des éléments semiconducteurs est réparé, tout d'abord la soudure est fondue par chauffage de l'élément semiconducteur pour qu'il soit retiré. Puis, l'élément semiconducteur est retiré de la carte à circuit imprimé en tirant le fil de liaison relié à l'élément semiconducteur alors que la soudure est à l'état fondu.
(JA)
 回路基板上に半田を使用して実装された複数の半導体素子を備える半導体装置のリペア方法が開示される。各半導体素子は、他の半導体素子及び前記回路基板上に設けられた配線部に対してボンディングワイヤで接続されている。半導体素子のリペアを行う場合には、先ず除去すべき半導体素子を加熱して前記半田を溶融させる。続いて、前記半田が溶融した状態で、前記除去すべき半導体素子に接続されているボンディングワイヤを引っ張って該半導体素子を前記回路基板上から除去する。
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