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1. WO2007105368 - 半導体パッケージの実装装置

公開番号 WO/2007/105368
公開日 20.09.2007
国際出願番号 PCT/JP2007/000185
国際出願日 08.03.2007
IPC
H01L 23/427 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
42加熱または冷却を容易にするために選択されたまたは配列された容器の充填または補助部材
427状態の変化による冷却,例.ヒートパイプの使用
H01L 23/12 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
12マウント,例.分離できない絶縁基板
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H01L 23/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
64Impedance arrangements
66High-frequency adaptations
H01L 2924/12044
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
10Details of semiconductor or other solid state devices to be connected
11Device type
12Passive devices, e.g. 2 terminal devices
1204Optical Diode
12044OLED
H05K 1/0219
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0216Reduction of cross-talk, noise or electromagnetic interference
0218by printed shielding conductors, ground planes or power plane
0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
出願人
  • 株式会社 東芝 KABUSHIKI KAISHA TOSHIBA [JP/JP]; 〒1058001 東京都港区芝浦一丁目1番1号 Tokyo 1-1, Shibaura 1-chome, Minato-ku, Tokyo 1058001, JP (AllExceptUS)
  • 高木一考 TAKAGI, Kazutaka [JP/JP]; JP (UsOnly)
発明者
  • 高木一考 TAKAGI, Kazutaka; JP
代理人
  • 特許業務法人 天城国際特許事務所 AMAGI INTERNATIONAL PATENT LAW OFFICE; 〒2120013 神奈川県川崎市幸区堀川町580番地ソリッドスクエア 東館4階 Kanagawa SOLID SQUARE EAST TOWER 4F 580, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa 2120013, JP
優先権情報
2006-06576710.03.2006JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SEMICONDUCTOR PACKAGE MOUNTING APPARATUS
(FR) APPAREIL DE MONTAGE DE PAQUET SEMICONDUCTEUR
(JA) 半導体パッケージの実装装置
要約
(EN)
In a package (13), a power amplifier semiconductor element is mounted to have a heat dissipating base surface as a high frequency ground. The package is flip-mounted, in a vertically inverted manner, on a recessed section (12) formed on a case (11) whose heat dissipating surface is the same as a high frequency ground. Since the heat dissipating base surface of the package (13) is at the top, a cooling mechanism (14) which is thermally independent from the case (11) is arranged. A cooling mechanism (14) is composed of a heat dissipating fin (15) and a heat pipe (16). As the cooling mechanism of the power amplifier semiconductor element is independently arranged, the semiconductor element is prevented from being thermally affected by other electronic component devices, and degree of freedom in cooling system design is remarkably increased.
(FR)
Dans un paquet (13), un élément semi-conducteur amplificateur de puissance est monté avec une surface de base dissipatrice de chaleur et une masse haute fréquence. Le paquet est monté renversé, d'une manière inversée verticalement, sur une section (12) enfoncée, formée sur un boîtier (11) dont la surface dissipatrice de chaleur est la même que la masse haute fréquence. Puisque la surface de base dissipatrice de chaleur du paquet (13) est au dessus, un mécanisme de refroidissement (14) qui est thermiquement indépendant du boîtier (11) est configuré. Un mécanisme (14) de refroidissement est composé d'une ailette (15) dissipatrice de chaleur et d'un caloduc (16). Comme le mécanisme de refroidissement de l'élément semi-conducteur amplificateur de puissance est configuré indépendamment, l'élément semi-conducteur ne peut être thermiquement affecté par d'autres dispositifs de composant électronique, et le degré de liberté dans la conception de système de refroidissement est remarquablement augmenté.
(JA)
 高周波グランドと放熱面が同じである筐体11に形成された凹部12に、放熱べ一ス面が高周波グランドとなるように電力増幅用半導体素子が実装されたパッケージ13を上下反転した状態でフリップ実装を行う。パッケージ13の放熱ベース面が上方向になるので、ここに筐体11とは熱的に独立した冷却機構14を設置する。冷却機構14は放熱フィン15とヒートパイプ16で構成されている。電力増幅用半導体素子の冷却機構が独立になるので、他の電子部品装置との熱的影響を防止し冷却システムの設計の自由度が大幅に向上できる。
他の公開
US11850996
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