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1. WO2007102482 - 実装方法、電気部品付き基板及び電気装置

公開番号 WO/2007/102482
公開日 13.09.2007
国際出願番号 PCT/JP2007/054267
国際出願日 06.03.2007
IPC
H01L 21/60 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
50サブグループH01L21/06~H01L21/326の一つに分類されない方法または装置を用いる半導体装置の組立
60動作中の装置にまたは装置から電流を流すためのリードまたは他の導電部材の取り付け
H05K 3/32 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
30電気部品,例.抵抗器,を印刷回路に取り付けること
32印刷回路に対する電気部品または電線の電気的接続
CPC
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/2919
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
2919with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H01L 2224/2929
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
29198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
29199Material of the matrix
2929with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H01L 2224/293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
29198with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
29298Fillers
29299Base material
293with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/73204
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73201on the same surface
73203Bump and layer connectors
73204the bump connector being embedded into the layer connector
出願人
  • ソニーケミカル&インフォメーションデバイス株式会社 SONY CHEMICAL & INFORMATION DEVICE CORPORATION [JP/JP]; 〒1410032 東京都品川区大崎1丁目11-2 ゲートシティ大崎イーストタワー8階 Tokyo Gate City Osaki East Tower 8F, 1-11-2, Osaki, Shinagawa-ku Tokyo 1410032, JP (AllExceptUS)
  • 古田 和隆 FURUTA, Kazutaka [JP/JP]; JP (UsOnly)
  • 蟹澤 士行 KANISAWA, Shiyuki [JP/JP]; JP (UsOnly)
  • 谷口 雅樹 TANIGUCHI, Masaki [JP/JP]; JP (UsOnly)
発明者
  • 古田 和隆 FURUTA, Kazutaka; JP
  • 蟹澤 士行 KANISAWA, Shiyuki; JP
  • 谷口 雅樹 TANIGUCHI, Masaki; JP
代理人
  • 石島 茂男 ISHIJIMA, Shigeo; 〒1050001 東京都港区虎ノ門1丁目2-18 虎ノ門興業ビル3階 Tokyo Toranomonkougyou Bldg., 3F, 1-2-18, Toranomon, Minato-ku Tokyo 1050001, JP
優先権情報
2006-06060007.03.2006JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) MOUNTING METHOD, BOARD WITH ELECTRICAL COMPONENT, AND ELECTRICAL APPARATUS
(FR) PROCEDE DE MONTAGE, CARTE AVEC COMPOSANT ELECTRIQUE ET APPAREIL ELECTRIQUE
(JA) 実装方法、電気部品付き基板及び電気装置
要約
(EN)
An electrical apparatus with high reliability. An adhesive layer (20) contains a thermosetting resin and a radiation-curable resin. A part of the adhesive layer (20) overlaps from the edges of an electrical component (15). Radiation (29) is not transmitted through the electrical component (15). Therefore, the radiation-curable resin is not polymerized at the portion of the adhesive layer (20) positioned just at the rear of the electrical component (15) but polymerized at the projecting portions (26). Since the electrical component (15) is fixed by the polymerized radiation-curable resin, the electrical component (15) is not positionally displaced when the electrical component (15) is heated and pressed.
(FR)
La présente invention concerne un appareil électrique de haute fiabilité. Une couche adhésive (20) contient une résine à fixage thermique et une résine durcissable par radiations. Une partie de la couche adhésive (20) fait un recouvrement à partir des bords d'un composant électrique (15). Une radiation (29) n'est pas transmise à travers le composant électrique (15). Ainsi, la résine durcissable par radiations n'est pas polymérisée sur la partie de la couche adhésive (20) placée juste à l'arrière du composant électrique (15) mais polymérisée sur les parties projetées (26). Puisque le composant électrique (15) est fixé par la résine durcissable par radiation et polymérisée, le composant électrique (15) n'est pas déplacé en position lorsqu'il (15) est chauffé et pressé.
(JA)
 信頼性の高い電気装置を製造する。  接着剤層20は熱硬化性樹脂と放射線硬化性樹脂を含有しており、接着剤層20の一部は電気部品15の縁よりも外側にはみ出ている。放射線29は電気部品15を透過せず、接着剤層20の電気部品15の真裏に位置する部分では、放射線硬化性樹脂は重合しないが、はみ出し部分26では放射線硬化性樹脂が重合する。電気部品15は重合した放射線硬化型樹脂によって固定されるから、電気部品15を加熱押圧する時に、電気部品15の位置ずれが起こらない。
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