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1. WO2007007857 - 多層プリント配線板

公開番号 WO/2007/007857
公開日 18.01.2007
国際出願番号 PCT/JP2006/314011
国際出願日 07.07.2006
IPC
H05K 3/46 2006.1
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
46多重層回路の製造
CPC
H01L 23/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 1/115
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
115Via connections; Lands around holes or via connections
H05K 2201/0352
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
0352Differences between the conductors of different layers of a multilayer
H05K 2201/0394
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0388Other aspects of conductors
0394Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
H05K 2201/09563
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09563Metal filled via
出願人
  • イビデン株式会社 IBIDEN CO., LTD. [JP]/[JP] (AllExceptUS)
  • 高橋 通昌 TAKAHASHI, Michimasa [JP]/[JP] (UsOnly)
  • 三門 幸信 MIKADO, Yukinobu [JP]/[JP] (UsOnly)
  • 中村 武信 NAKAMURA, Takenobu [JP]/[JP] (UsOnly)
  • 青山 雅一 AOYAMA, Masakazu [JP]/[JP] (UsOnly)
発明者
  • 高橋 通昌 TAKAHASHI, Michimasa
  • 三門 幸信 MIKADO, Yukinobu
  • 中村 武信 NAKAMURA, Takenobu
  • 青山 雅一 AOYAMA, Masakazu
代理人
  • 小川 順三 OGAWA, Junzo
優先権情報
2005-19944307.07.2005JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) MULTILAYER PRINTED WIRING BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE
(JA) 多層プリント配線板
要約
(EN) In a multilayer printed wiring board, each insulating layer has a thickness of 100μm or less. The multilayer printed wiring board has a multilayer stacked via structure wherein a plurality of via holes for electrically connecting conductor circuits on the insulating layers have a tapered shape whose diameter gradually reduces as it goes from the surface of the insulating layer to the inner side and such via holes are arranged to face each other. External stresses, such as a force of impact when dropped, are suppressed to have an insulating substrate not to easily warp, and cracks, disconnection, and the like of the conductor circuit are prevented. Thus, deterioration of reliability and drop impact resistance of a mounting substrate can be reduced.
(FR) La présente invention concerne une carte de circuit imprimé multicouche dont chaque couche isolante présente une épaisseur inférieure ou égale à 100 µm. La carte de circuit imprimé multicouche comprend une structure de liaison superposée en plusieurs couches dans laquelle une pluralité de trous de raccordement pour une connexion électrique des circuits conducteurs sur les couches isolantes ont une forme conique dont le diamètre diminue progressivement depuis la surface de la couche isolante vers le côté intérieur, ces trous étant disposés en vis-à-vis. Des contraintes externes, telles qu’une force d’impact en cas de chute, sont éliminées pour obtenir un substrat isolant qui résiste à la torsion, et la craquelure, la déconnexion ou une action similaire du circuit conducteur sont évitées. On peut ainsi réduire une perte de fiabilité et de résistance au choc de chute d’un substrat de montage.
(JA) 多層プリント配線板は、各絶縁層の厚さを100μm以下にすると共に、各絶縁層上の導体回路を電気的に接続する複数のバイアホールを、絶縁層表面から内側に向かうにつれて縮径するようなテーパ形状とし、それらのバイアホールを対向配置して多段スタックビア構造を有してなる。落下した際の衝撃力等の外部応力を抑制して、絶縁基板が反りにくくして、導体回路のクラックや、断線等を防止し、実装基板の信頼性や耐落下性の低下を軽減することができる。
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