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1. WO2006132253 - 熱伝導性オイル組成物、放熱剤および電子機器

公開番号 WO/2006/132253
公開日 14.12.2006
国際出願番号 PCT/JP2006/311339
国際出願日 06.06.2006
IPC
C09K 5/08 2006.01
C化学;冶金
09染料;ペイント;つや出し剤;天然樹脂;接着剤;他に分類されない組成物;他に分類されない材料の応用
K他に分類されない応用される物質;他に分類されない物質の応用
5伝熱,熱交換または蓄熱用物質,例.冷媒;燃焼以外の化学反応によって熱または冷気を発生させるための物質
08使用時に物理的状態の変化を伴わない物質
H01L 23/36 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
36冷却または加熱を容易にするための材料の選択または成形,例.ヒート・シンク
H05K 7/20 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
7異なる型の電気装置に共通の構造的細部
20冷却,換気または加熱を容易にするための変形
CPC
C09K 5/10
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08Materials not undergoing a change of physical state when used
10Liquid materials
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/16227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16227the bump connector connecting to a bond pad of the item
H01L 2224/32245
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32245the item being metallic
H01L 2224/73253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73253Bump and layer connectors
出願人
  • ニホンハンダ株式会社 Nihon Handa Co., Ltd. [JP]/[JP] (AllExceptUS)
  • 峯 勝利 MINE, Katsutoshi [JP]/[JP] (UsOnly)
  • 赤間 大介 AKAMA, Daisuke [JP]/[JP] (UsOnly)
  • 前田 ゆう子 MAEDA, Yuko [JP]/[JP] (UsOnly)
発明者
  • 峯 勝利 MINE, Katsutoshi
  • 赤間 大介 AKAMA, Daisuke
  • 前田 ゆう子 MAEDA, Yuko
代理人
  • 久保田 芳譽 KUBOTA, Yoshitaka
優先権情報
2005-16712107.06.2005JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) THERMALLY CONDUCTIVE OIL COMPOSITION, HEAT RADIATING AGENT AND ELECTRONIC EQUIPMENT
(FR) COMPOSITION D’HUILE THERMOCONDUCTRICE, AGENT DE RADIATION THERMIQUE ET ÉQUIPEMENT ÉLECTRONIQUE
(JA) 熱伝導性オイル組成物、放熱剤および電子機器
要約
(EN)
[PROBLEMS] To provide a thermally conductive oil composition, which has excellent thermally conductive properties and heat resistance and is much less likely to cause bleed out of a base oil and a liquid substance, and a heat radiating agent and an electronic equipment which is less likely to store heat. [MEANS FOR SOLVING PROBLEMS] A thermally conductive oil composition and a heat radiating agent, characterized by comprising (A)a heat resistant organic oil (for example, a phenyl ether oil), (B) thermally conductive fine particles (for example, finely particulate silica, alumina, and silver) and (C) a sorbitol-based thixotropic agent or an amide-based thixotropic agent. An electronic equipment comprising the thermally conductive oil composition or the heat radiating agent.
(FR)
Le problème à résoudre dans le cadre de la présente invention consiste à procurer une composition d’huile thermoconductrice qui présente d’excellentes propriétés de thermoconduction et de résistance thermique et qui soit beaucoup moins susceptible de causer des coulures à partir d’une huile de base et d’une substance liquide, et un agent de radiation thermique et un équipement électronique qui soit moins susceptible d’accumuler de la chaleur. La solution proposé consiste en une composition d’huile thermoconductrice et un agent de radiation thermique, caractérisé en ce qu’il comprend (A) une huile organique thermorésistante (par exemple, une huile d’éther phényle), (B) des particules fines thermoconductrices (par exemple de la silice, de l’alumine et de l’argent finement particulaires) et (C) un agent thixotropique à base de sorbitol ou un agent thixotropique à base d’amide. L’invention concerne également un équipement électronique comprenant la composition d’huile thermoconductrice ou l’agent de radiation thermique.
(JA)
[課題]優れた熱伝導性、耐熱性を有し、かつ、基油や液状物質のブリードアウトが極めて少ない熱伝導性オイル組成物、放熱剤および畜熱しにくい電子機器を提供する。 [解決手段](A)耐熱性有機オイル(例、フェニルエーテル系オイル)、(B)熱伝導性微粒子(例、微粒子状のシリカ、アルミナ、銀)および(C)ソルビトール系チクソ剤またはアマイド系チクソ剤からなることを特徴とする熱伝導性オイル組成物、放熱剤。該熱伝導性オイル組成物、放熱剤を使用した電子機器。
他の公開
EP6757077
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