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1. WO2005036623 - 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法

公開番号 WO/2005/036623
公開日 21.04.2005
国際出願番号 PCT/JP2004/014945
国際出願日 08.10.2004
IPC
H01L 21/00 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
H01L 21/687 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
67製造または処理中の半導体または電気的固体装置の取扱いに特に適用される装置;半導体または電気的固体装置もしくは構成部品の製造または処理中のウエハの取扱いに特に適用される装置
683支持または把持のためのもの
687機械的手段を使用するもの,例.チャック,クランプ,またはピンチ
CPC
G03F 7/70341
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70216Systems for imaging mask onto workpiece
70341Immersion
G03F 7/7075
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70691Handling of masks or wafers
70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
7075Handling workpieces outside exposure position, e.g. SMIF box
G03F 7/70925
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution, removing pollutants from apparatus; electromagnetic and electrostatic-charge pollution
70925Cleaning, i.e. actively freeing apparatus from pollutants
H01L 21/67051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67051using mainly spraying means, e.g. nozzles
H01L 21/68707
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68707the wafers being placed on a robot blade, or gripped by a gripper for conveyance
出願人
  • 株式会社 蔵王ニコン ZAO NIKON CO., LTD. [JP]/[JP] (AllExceptUS)
  • 株式会社ニコン NIKON CORPORATION [JP]/[JP] (AllExceptUS)
  • 丹野 信義 TANNO, Nobuyoshi [JP]/[JP] (UsOnly)
  • 堀内 貴史 HORIUCHI, Takashi [JP]/[JP] (UsOnly)
発明者
  • 丹野 信義 TANNO, Nobuyoshi
  • 堀内 貴史 HORIUCHI, Takashi
代理人
  • 志賀 正武 SHIGA, Masatake
優先権情報
2003-34954908.10.2003JP
2003-34955208.10.2003JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) SUBSTRATE TRANSPORTING APPARATUS AND METHOD, EXPOSURE APPARATUS AND METHOD, AND DEVICE PRODUCING METHOD
(FR) APPAREIL ET PROCEDE DE TRANSPORT DE SUBSTRAT, APPAREIL ET PROCEDE D'EXPOSITION, ET PROCEDE DE PRODUCTION DE DISPOSITIF
(JA) 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
要約
(EN)
A substrate transporting apparatus for transporting a substrate exposed with an image of a pattern through a projection optical system and a liquid has a substrate supporting member for supporting the substrate and a liquid removing mechanism for removing the liquid adhered to at least either the substrate supporting member or at least a portion of a region of the back face of the substrate.
(FR)
L'invention concerne un appareil de transport de substrat conçu pour transporter un substrat exposé comprenant une image d'un motif dans un système optique de projection et un liquide, qui comporte un élément porte-substrat permettant de porter le substrat et un mécanisme d'élimination de liquide permettant d'éliminer le liquide retenu sur au moins l'élément porte-substrat ou sur au moins une partie de la région de la face arrière du substrat.
(JA)
 投影光学系と液体とを介したパターンの像によって露光された基板を搬送する基板搬送装置は、前記基板を支持する基板支持部材と、前記基板支持部材と、前記基板の裏面のうち少なくとも一部の領域との少なくとも一方に付着した前記液体を除去する液体除去機構とを備える。
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