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1. WO2005034597 - 配線基板のパッド構造及び配線基板

公開番号 WO/2005/034597
公開日 14.04.2005
国際出願番号 PCT/JP2004/014126
国際出願日 21.09.2004
IPC
H01L 23/498 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
48動作中の固体本体からまたは固体本体へ電流を導く装置,例.リードまたは端子装置
488ハンダ付け構造または結合構造からなるもの
498絶縁基板上のリード
H05K 3/24 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
22印刷回路の2次的処理
24導電模様の補強
H05K 3/34 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
30電気部品,例.抵抗器,を印刷回路に取り付けること
32印刷回路に対する電気部品または電線の電気的接続
34ハンダ付けによるもの
CPC
C23C 18/1651
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1651Two or more layers only obtained by electroless plating
H01L 23/49816
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
49816Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 2203/072
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
07Treatments involving liquids, e.g. plating, rinsing
0703Plating
072Electroless plating, e.g. finish plating or initial plating
H05K 3/244
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing the conductive pattern
244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
H05K 3/3457
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
3457Solder materials or compositions; Methods of application thereof
出願人
  • 新光電気工業株式会社 SHINKO ELECTRIC INDUSTRIES CO., LTD. [JP]/[JP] (AllExceptUS)
  • 大井 和彦 OOI, Kazuhiko [JP]/[JP] (UsOnly)
  • 榎 建次郎 ENOKI, Kenjiro [JP]/[JP] (UsOnly)
  • 織田 祥子 ODA, Sachiko [JP]/[JP] (UsOnly)
発明者
  • 大井 和彦 OOI, Kazuhiko
  • 榎 建次郎 ENOKI, Kenjiro
  • 織田 祥子 ODA, Sachiko
代理人
  • 青木 篤 AOKI, Atsushi
優先権情報
2003-34517903.10.2003JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) PAD STRUCTURE OF WIRING BOARD AND WIRING BOARD
(FR) STRUCTURE DE PLOT POUR TABLEAU DE CONNEXIONS, ET TABLEAU DE CONNEXIONS
(JA) 配線基板のパッド構造及び配線基板
要約
(EN)
A pad structure (40) of a wiring board being provided on a conductive pattern of the board and having a solder bump (20) mounted thereon, which is composed of a multi-plated layer comprising a metal layer (10) being formed as a part of the conductive pattern and constituting the main body of the bump, a phosphorus-containing nickel layer (12) being formed by electroless nickel plating and directly contacting with said metal layer, a copper layer (14) being formed on said nickel layer by electroless copper plating and having a thickness less than that of the nickel layer and a noble metal layer (16) being formed on said copper layer by electroless plating of the noble metal. The above pad structure of a wiring board allows, in a pad having a phosphorus-containing nickel layer, the improvement of the tensile strength of a solder member mounted thereon, such as a solder ball, or an external member soldered.
(FR)
L'invention concerne une structure de plot (40) pour tableau de connexions installée sur un motif conducteur du tableau, et sur laquelle un bossage de soudure (20) est monté. La structure de plot comprend des couches multiples dont: une couche métallique (10) formant bloc avec le motif conducteur et constituant le corps principal du bossage; une couche de nickel phosphoré (12) formée par dépôt autocatalytique de nickel et en contact direct avec la couche métallique; une couche de cuivre (14) formée sur la couche de nickel par dépôt autocatalytique de cuivre et présentant une épaisseur inférieure à celle de la couche de nickel; et une couche de métal précieux (16) formée sur la couche de cuivre par dépôt autocatalytique du métal précieux. La structure de plot pour tableau de connexions de l'invention améliore, dans un plot présentant une couche de nickel phosphoré, la résistance à la traction d'un élément de soudure monté sur la structure, tel qu'une globule de soudure ou un élément externe soudé.
(JA)
燐含有のニッケル層を具備するパッドに搭載したはんだボール等のはんだ部材又ははんだ付けした外部部材の引張強度を向上し得る、配線基板のパッド構造を得る。基板の導体パターンに設けられた、はんだバンプ(20)が搭載されパッド構造(40)が、導体パターンの一部として形成され且つパッド本体を形成する金属層(10)と、該金属層上に直接接触する無電解ニッケルめっきにより形成された燐含有のニッケル層(12)と、該ニッケル層上に無電解銅めっきにより形成された、前記ニッケル層よりも薄い銅層(14)と、該銅層上に無電解貴金属めっきにより形成された貴金属層(16)と、からなる多層めっき層に形成されている。
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