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1. WO2005033235 - 放熱シール

公開番号 WO/2005/033235
公開日 14.04.2005
国際出願番号 PCT/JP2004/015178
国際出願日 06.10.2004
IPC
H01L 23/373 2006.01
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
34冷却,加熱,換気または温度補償用装置
36冷却または加熱を容易にするための材料の選択または成形,例.ヒート・シンク
373装置用材料の選択により容易になる冷却
H05K 7/20 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
7異なる型の電気装置に共通の構造的細部
20冷却,換気または加熱を容易にするための変形
CPC
H01L 23/3737
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3737Organic materials with or without a thermoconductive filler
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 31/09
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
08in which radiation controls flow of current through the device, e.g. photoresistors
09Devices sensitive to infra-red, visible or ultraviolet radiation
H05K 7/20418
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
20418the radiating structures being additional and fastened onto the housing
H05K 7/20481
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
20445the coupling element being an additional piece, e.g. thermal standoff
20472Sheet interfaces
20481characterised by the material composition exhibiting specific thermal properties
出願人
  • 沖電気工業株式会社 OKI ELECTRIC INDUSTRY CO., LTD. [JP]/[JP] (AllExceptUS)
  • CERAMISSION CO., LTD. [JP]/[JP] (AllExceptUS)
  • 小板橋 雄也 KOITABASHI, Yuya [JP]/[JP] (UsOnly)
  • 町田 政広 MACHIDA, Masahiro [JP]/[JP] (UsOnly)
  • 出牛 雄一 DEUSHI, Yuichi [JP]/[JP] (UsOnly)
  • 清水 光一郎 SHIMIZU, Koichiro [JP]/[JP] (UsOnly)
  • KANEKO, Noriyoshi [JP]/[JP] (UsOnly)
  • OTA, Akira [JP]/[JP] (UsOnly)
発明者
  • 小板橋 雄也 KOITABASHI, Yuya
  • 町田 政広 MACHIDA, Masahiro
  • 出牛 雄一 DEUSHI, Yuichi
  • 清水 光一郎 SHIMIZU, Koichiro
  • KANEKO, Noriyoshi
  • OTA, Akira
代理人
  • 香取 孝雄 KATORI, Takao
優先権情報
2003-34684706.10.2003JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) HEAT DISSIPATING ADHESIVE TAPE
(FR) BANDE ADHESIVE DISSIPANT LA CHALEUR
(JA) 放熱シール
要約
(EN)
Disclosed is a heat dissipating adhesive tape comprising a one-side adhesive tape wherein an adhesive surface is provided on one side of a flexible base material having electrical insulating properties and an infrared light emitting/receiving film having infrared light emitting effects and infrared light receiving effects. The infrared light emitting/receiving film is formed on one surface of the one-side adhesive tape which is opposite to the adhesive surface. With such a constitution, the heat dissipating adhesive tape prevents short circuits while exhibiting excellent cooling effects, when it is used for cooling a heating body such as an electrical/electronic device.
(FR)
L'invention concerne une bande adhésive dissipant la chaleur comprenant une bande adhésive à un seul côté dont la surface adhésive se trouve sur un côté de la matière de base flexible ayant des propriétés d'isolation électrique et un film d'émission/réception de lumière infrarouge présentant des effets d'émission et de réception d'infrarouges. Ce film est formé sur une surface de la bande adhésive à une seule face en regard à la surface adhésive. Avec une telle constitution, la bande adhésive à dissipation thermique évite les courts-circuits tout en faisant preuve d'excellents effets refroidissants lors de son utilisation en vue du refroidissement d'un corps chauffant, notamment un dispositif électrique/électronique.
(JA)
本放熱シールは、電気絶縁性を有する可撰性のベース材の片面に粘着面を設けた片面粘着テープの粘着面の反対側の面に、赤外線放射効果および赤外線受光効果を有する赤外線放射受光膜を形成したものである。これにより、電気・電子機器等の発熱体の冷却の際に、ショート等を防止し、かつ優れた冷却効果を得ることができる。
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