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1. WO2005030896 - 接着補助剤組成物

公開番号 WO/2005/030896
公開日 07.04.2005
国際出願番号 PCT/JP2004/006259
国際出願日 11.05.2004
予備審査請求日 25.07.2005
IPC
H05K 3/38 2006.01
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
38絶縁基体と金属間の接着の改良
CPC
C09J 177/10
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
177Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain
10Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
H05K 3/386
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
386by the use of an organic polymeric bonding layer, e.g. adhesive
Y10T 428/2852
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
2852Adhesive compositions
Y10T 428/31721
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
31504Composite [nonstructural laminate]
31721Of polyimide
出願人
  • 日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP]/[JP] (AllExceptUS)
  • 内田 誠 UCHIDA, Makoto [JP]/[JP] (UsOnly)
  • 浅野豊文 ASANO, Toyofumi [JP]/[JP] (UsOnly)
発明者
  • 内田 誠 UCHIDA, Makoto
  • 浅野豊文 ASANO, Toyofumi
優先権情報
2003-33624326.09.2003JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) ADHESIVE AID COMPOSITION
(FR) COMPOSITION FAVORISANT L'ADHERENCE
(JA) 接着補助剤組成物
要約
(EN)
An adhesive aid composition which has excellent strength of bonding to polyimide films, etc. without lowering mechanical properties and is useful in the field of electrical materials. The adhesive aid composition comprises a polyamide containing phenolic hydroxy groups and a solvent as essential ingredients. The polyamide containing phenolic hydroxy groups preferably is one having segments represented by the following formula (1): (1) (wherein R1 represents a divalent aromatic group and n, indicating the average number of the substituents, is a positive number of 1 to 4). The adhesive aid composition is suitable for use in the bonding of polyimide films.
(FR)
La présente invention se rapporte à une composition favorisant l'adhérence, qui présente une excellente force de liaison à des films polyimide, etc., sans en amoindrir les propriétés mécaniques, et qui est utile dans le domaine des matériaux électriques. La composition favorisant l'adhérence selon l'invention contient, comme ingrédients essentiels, un polyamide renfermant des groupes hydroxy phénoliques et un solvant. Le polyamide contenant des groupes hydroxy phénoliques possède de préférence des segments représentés par la formule suivante (I), dans laquelle R1 représente un groupe aromatique divalent et n, qui indique le nombre moyen de substituants, est un chiffre positif compris entre 1 et 4. La composition favorisant l'adhérence selon l'invention est adaptée à une utilisation pour la liaison de films polyimide.
(JA)
not available
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