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1. WO2004088742 - 基板搬送システム

公開番号 WO/2004/088742
公開日 14.10.2004
国際出願番号 PCT/JP2004/003942
国際出願日 23.03.2004
IPC
H01L 21/677 2006.1
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
67製造または処理中の半導体または電気的固体装置の取扱いに特に適用される装置;半導体または電気的固体装置もしくは構成部品の製造または処理中のウエハの取扱いに特に適用される装置
677移送のためのもの,例.異なるワ―クステーション間での移送
CPC
H01L 21/67727
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67703between different workstations
67727using a general scheme of a conveying path within a factory
H01L 21/67736
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67703between different workstations
67736Loading to or unloading from a conveyor
H01L 21/67766
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67766Mechanical parts of transfer devices
H01L 21/67775
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67775Docking arrangements
H01L 21/67778
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67778involving loading and unloading of waers
出願人
  • 平田機工株式会社 HIRATA CORPORATION [JP]/[JP] (AllExceptUS)
  • NAITO, Yasushi, [JP]/[JP] (UsOnly)
発明者
  • NAITO, Yasushi,
代理人
  • OHTSUKA, Yasunori,
優先権情報
2003-09179428.03.2003JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) WAFER TRANSPORTATION SYSTEM
(FR) SYSTEME DE TRANSPORT DE PLAQUETTES
(JA) 基板搬送システム
要約
(EN) A wafer transportation system for effectively transporting wafers to a processing device. Two rails are vertically and parallelly arranged on inner sidewalls of a tunnel. The two rails each can support wafer transportation vehicles, and the vehicles drive along the rails by the drive of a motor. The tunnel has in its inside a first transportation path for transporting wafers and a second transportation path for transporting, above the first transportation path, wafers.
(FR) L'invention concerne un système de transport de plaquettes permettant de transporter efficacement des plaquettes vers un dispositif de traitement. Deux rails sont conçus verticalement et parallèlement sur des parois latérales intérieures d'un tunnel. Les deux rails peuvent chacun supporter des véhicules de transport de plaquettes et les véhicules circulent le long des rails, entraînés par un moteur. Le tunnel présente, à l'intérieur, un premier chemin de transport destiné au transport de plaquettes et un second chemin de transport destiné au transport de plaquettes au-dessus du premier chemin de transport.
(JA)  処理装置に対して効率的に基板を搬送する基板搬送システム。トンネルの内部側壁には、2本のレールが上下方向に平行に設けられている。これら2本のレールは、それぞれ複数の基板搬送車を支持可能であり、基板搬送車は、モータの駆動によりレールに沿って自走する。これによりトンネルは、その内部に、基板を搬送する第1搬送路と、第1搬送路の上方で基板を搬送する第2搬送路とを有することになる。
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