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1. WO2004088740 - 基板搬送システム

公開番号 WO/2004/088740
公開日 14.10.2004
国際出願番号 PCT/JP2004/003922
国際出願日 23.03.2004
IPC
H01L 21/00 2006.1
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
H01L 21/677 2006.1
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
67製造または処理中の半導体または電気的固体装置の取扱いに特に適用される装置;半導体または電気的固体装置もしくは構成部品の製造または処理中のウエハの取扱いに特に適用される装置
677移送のためのもの,例.異なるワ―クステーション間での移送
CPC
H01L 21/67017
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
H01L 21/67727
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67703between different workstations
67727using a general scheme of a conveying path within a factory
H01L 21/67736
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67703between different workstations
67736Loading to or unloading from a conveyor
H01L 21/67742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67742Mechanical parts of transfer devices
H01L 21/67778
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67778involving loading and unloading of waers
出願人
  • 平田機工株式会社 HIRATA CORPORATION [JP]/[JP] (AllExceptUS)
  • 内藤 靖 NAITO, Yasushi [JP]/[JP] (UsOnly)
発明者
  • 内藤 靖 NAITO, Yasushi
代理人
  • 大塚 康徳 OHTSUKA, Yasunori
優先権情報
2003-09179628.03.2003JP
公開言語 (言語コード) 日本語 (ja)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) WAFER TRANSPORTATION SYSTEM
(FR) SYSTEME DE TRANSPORT DE PLAQUETTES
(JA) 基板搬送システム
要約
(EN) A wafer transportation system with which a system scale can be downsized. In the transportation system, a pump function is integrated in an air discharge unit. Air discharged from the air discharge unit is again sent to an ULPA unit through a pipe.
(FR) L'invention concerne un système de transport de plaquettes qui permet de réduire la taille d'un système. Dans ce système de transport, une fonction pompe est intégrée dans une unité d'évacuation d'air. L'air déchargé de l'unité d'évacuation d'air est à nouveau envoyée à une unité ULPA par une conduite.
(JA) システム規模を小さくすることが可能な基板搬送システム。基板搬送システムでは、空気排出ユニットにポンプ機能が組込まれている。そして空気排出ユニットから排出された空気は、パイプを通じて再度ULPAユニットに送られる。
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