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1. WO2004040946 - 積層体、配線付き基体、有機EL表示素子、有機EL表示素子の接続端子及びそれらの製造方法

公開番号 WO/2004/040946
公開日 13.05.2004
国際出願番号 PCT/JP2003/013077
国際出願日 10.10.2003
IPC
H05B 33/06 2006.01
H電気
05他に分類されない電気技術
B電気加熱;他に分類されない電気照明
33エレクトロルミネッセンス光源
02細部
06電極端子
H05B 33/14 2006.01
H電気
05他に分類されない電気技術
B電気加熱;他に分類されない電気照明
33エレクトロルミネッセンス光源
12実質的に2次元放射面をもつ光源
14エレクトロルミネッセンス材料の配置あるいは化学的または物理的組成によって特徴づけられたもの
CPC
H01L 27/3288
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3281Passive matrix displays
3288Wiring lines
H01L 51/0017
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0014for changing the shape of the device layer, e.g. patterning
0017etching of an existing layer
H01L 51/0021
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0021Formation of conductors
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Y10S 428/917
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
428Stock material or miscellaneous articles
917Electroluminescent
Y10T 428/24917
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
24Structurally defined web or sheet [e.g., overall dimension, etc.]
24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
24917including metal layer
出願人
  • ASAHI GLASS COMPANY, LIMITED [JP]/[JP]
発明者
  • HIRUMA, Takehiko
  • AKAO, Yasuhiko
  • FUJIWARA, Teruo
  • NAKAMURA, Nobuhiro
代理人
  • SENMYO, Kenji
優先権情報
2002-30327817.10.2002JP
公開言語 (言語コード) 日本語 (JA)
出願言語 (言語コード) 日本語 (JA)
指定国 (国コード)
発明の名称
(EN) MULTILAYER BODY, BASE WITH WIRING, ORGANIC EL DISPLAY DEVICE, CONNECTION TERMINAL OF ORGANIC EL DISPLAY DEVICE, AND METHODS FOR MANUFACTURING THESE
(FR) CORPS MULTICOUCHE, BASE DOTE DE CABLAGE, DISPOSITIF D'AFFICHAGE EL ORGANIQUE, TERMINAL DE CONNEXION DU DISPOSITIF D'AFFICHAGE EL ORGANIQUE, ET LEURS PROCEDES DE FABRICATION
(JA) 積層体、配線付き基体、有機EL表示素子、有機EL表示素子の接続端子及びそれらの製造方法
要約
(EN)
A multilayer body which is used for formation of a base with wiring and comprises a conductor layer that is formed on a base and mainly contains Al or an Al alloy and a cap layer that is formed on the conductor layer and mainly contains an Ni-Mo alloy is disclosed. A base with wiring formed by etching the multilayer body to remove unnecessary metals and a method for manufacturing such a base are also disclosed.
(FR)
L'invention concerne un corps multicouche utilisé pour la formation d'une base dotée de câblage, comprenant une couche conductrice formée sur une base, contenant principalement Al ou un alliage d'Al et une couche de couverture formée sur la couche conductrice, contenant principalement un alliage de Ni-Mo. L'invention concerne une base dotée de câblage formée par l'attaque du corps multicouche pour retirer des métaux non nécessaires, et un procédé de fabrication d'une telle base.
(JA)
基体上にAlまたはAl合金を主成分とする導体層と、該導体層の上にNi−Mo合金を主成分とするキャップ層とで形成された配線付き基体形成用の積層体と、該積層体をエッチングして不要な金属を除去してなる配線付き基体とその製造方法。
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