WIPO logo
Mobile | Deutsch | English | Español | Français | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

国際・国内特許データベース検索
World Intellectual Property Organization
検索
 
閲覧
 
翻訳
 
オプション
 
最新情報
 
ログイン
 
ヘルプ
 
自動翻訳
1. (WO2004014608) 基板の研磨方法及びその装置
国際事務局に記録されている最新の書誌情報   

Translation翻訳: 原文 > 日本語
国際公開番号:    WO/2004/014608    国際出願番号:    PCT/JP2003/009745
国際公開日: 19.02.2004 国際出願日: 31.07.2003
IPC:
G02F 1/1333 (2006.01), B24B 37/04 (2012.01)
出願人: ASAHI GLASS COMPANY, LIMITED [JP/JP]; 12-1, Yurakucho 1-chome, Chiyoda-ku, Tokyo 100-8405 (JP) (米国を除く全ての指定国).
WATANABE, Itsuro [JP/JP]; (JP) (米国のみ).
KUBO, Takashi [JP/JP]; (JP) (米国のみ)
発明者: WATANABE, Itsuro; (JP).
KUBO, Takashi; (JP)
代理人: SENMYO, Kenji; Torimoto Kogyo Bldg., 38, Kanda-Higashimatsushitacho, Chiyoda-ku, Tokyo 101-0042 (JP)
優先権情報:
2002-223001 31.07.2002 JP
発明の名称: (EN) METHOD AND DEVICE FOR POLISHING SUBSTRATE
(FR) PROCEDE ET DISPOSITIF DE POLISSAGE D'UN SUBSTRAT
(JA) 基板の研磨方法及びその装置
要約: front page image
(EN)A method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate (G). In a substrate-polishing device, the substrate (G) is bonded to a film body (38) stretched on a film frame (14), and the film frame (14) is installed on a carrier (52). After that, the carrier (52) and a polishing surface-plate (62, 66) are brought closer relative to each other, and a polish surface of the substrate (G) bonded to the film body (38) is pressed to the polishing surface-plate (62, 66) for polishing. After the completion of the polishing, the film frame (14) is removed from the carrier (52), and the polished substrate (G) is removed from the film frame (14).
(FR)L'invention porte sur un procédé et le dispositif associé de polissage de substrats de verre (G) de grandes dimensions. Dans le dispositif de polissage, un substrat est fixé à une pellicule (38) étirée sur un cadre (14) lui-même placé sur un support (52), après quoi le support (52) et une plaque de polissage (62, 66) se rapprochent pour que la surface à polir du substrat (G) vienne au contact de la plaque de polissage (62, 66). Le polissage terminé, on retire le cadre (14) de son support (52), puis le substrat (G) du cadre (14).
(JA)not available
指定国: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
アフリカ広域知的所有権機関(ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW)
ユーラシア特許庁(EAPO) (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
欧州特許庁(EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR)
アフリカ知的所有権機関(OAPI) (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
国際公開言語: Japanese (JA)
国際出願言語: Japanese (JA)