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1. US20090322468 - Chip Resistor and Manufacturing Method Thereof

官庁 アメリカ合衆国
出願番号 11916625
出願日 01.06.2006
公開番号 20090322468
公開日 31.12.2009
公報種別 A1
IPC
H01C 1/01
H電気
01基本的電気素子
C抵抗器
1細部
01取り付け;支持
H01C 1/012
H電気
01基本的電気素子
C抵抗器
1細部
01取り付け;支持
012抵抗素子に沿って延び抵抗素子の固定または補強を行なう基板
H01C 17/00
H電気
01基本的電気素子
C抵抗器
17抵抗器を製造するために特に適用される装置または方法
出願人 KOA Corporation
発明者 Hanaoka Toshihiro
Murase Shinji
代理人 CROWELL &; MORING LLP;INTELLECTUAL PROPERTY GROUP
優先権情報 2005165672 06.06.2005 JP
発明の名称
(EN) Chip Resistor and Manufacturing Method Thereof
要約
(EN)

[Problem] To provide a chip resistor and a method for manufacturing thereof, the chip resistor keeping easily soldering strength even if mounted in a horizontal position, and never projects from a holding recess of a positioning jig in a mounting process, and further does not hinder miniaturization thereof from being promoted, while keeping a good appearance thereof.

[Means of Solution] In manufacturing a chip resistor 10, front-face electrodes 12 and resisters 13 are formed on the front face 20a of a large size substrate 20, and rear-face electrodes 16 are formed on the rear face 20b of the large size substrate 20. When the rear-face electrodes are formed, the rear-face electrodes 16 are extended to inclined faces of V-shaped grooves of second dividing grooves 22 on the rear face 20b and these extended parts are made to be side-face electrodes 16a. Then, the large size substrate 20 is divided along first dividing grooves 21 into strip substrates, and, after end-face electrodes 17 are formed on divided faces thereof by sputtering, the strip substrates 24 are divided along the second dividing grooves 22 and subjected to a plating process to provide an approximately square-prism shaped chip resistor 10 with electrodes exposed on each side face thereof.

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