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1. US20210083131 - END SURFACE INCIDENT-TYPE LIGHT RECEIVING ELEMENT

官庁
アメリカ合衆国
出願番号 16643406
出願日 31.08.2017
公開番号 20210083131
公開日 18.03.2021
公報種別 A1
IPC
H01L 31/0232
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
31赤外線,可視光,短波長の電磁波,または粒子線輻射に感応する半導体装置で,これらの輻射線エネルギーを電気的エネルギーに変換するかこれらの輻射線によって電気的エネルギーを制御かのどちらかに特に適用されるもの;それらの装置またはその部品の製造または処理に特に適用される方法または装置;それらの細部
02細部
0232装置と結合した光学素子または光学装置
F21S 41/24
F機械工学;照明;加熱;武器;爆破
21照明
S非携帯用の照明装置;そのシステム;車両外部に特に適合する車両照明
41車両外部に特に適合する照明装置,例.前照灯
20屈折器,透明な被覆板,ライトガイドまたはフィルターにより特徴付けられるもの
24ライトガイド
CPC
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
H01L 31/0232
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0232Optical elements or arrangements associated with the device
F21S 41/24
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
41Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
20characterised by refractors, transparent cover plates, light guides or filters
24Light guides
出願人 KYOTO SEMICONDUCTOR CO., LTD.
発明者 Etsuji OMURA
Takatomo ISOMURA
Ken USUI
発明の名称
(EN) END SURFACE INCIDENT-TYPE LIGHT RECEIVING ELEMENT
要約
(EN)

An end surface incident-type light receiving element according to an aspect of the present disclosure is made of a semiconductor material, and includes an upper surface and a lower surface that are opposite to each other in the vertical direction, and an end surface that couples the upper surface and the lower surface and is to be arranged on a light source side, the light source side being a side from which the light source emits light. At least a portion of the end surface is inclined relative to the vertical direction such that the lower surface side is arranged closer to the light source than the upper surface side is. The lower surface is provided with one or more grooves. The inclined surfaces on the end surface side of one or more grooves are arranged so as to reflect incident light that is emitted from the light source and passes through the end surface. A light receiving region for receiving the light reflected by the inclined surfaces on the end surface side of the one or more grooves is provided on the upper surface side.


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