ご意見送信
設定

設定

出願の表示

1. US20180105926 - Tantalum sputtering target, and production method therefor

パーマリンク
官庁
アメリカ合衆国
出願番号 15571562
出願日 17.05.2016
公開番号 20180105926
公開日 19.04.2018
特許番号 10570505
特許付与日 25.02.2020
公報種別 B2
IPC
C23C 14/34
C化学;冶金
23金属質材料への被覆;金属質材料による材料への被覆;化学的表面処理;金属質材料の拡散処理;真空蒸着,スパッタリング,イオン注入法,または化学蒸着による被覆一般;金属質材料の防食または鉱皮の抑制一般
C金属質への被覆;金属材料による材料への被覆;表面への拡散,化学的変換または置換による,金属材料の表面処理;真空蒸着,スパッタリング,イオン注入法または化学蒸着による被覆一般
14被覆形成材料の真空蒸着,スパッタリングまたはイオン注入法による被覆
22被覆の方法に特徴のあるもの
34スパッタリング
C22F 1/18
C化学;冶金
22冶金;鉄または非鉄合金;合金の処理または非鉄金属の処理
F非鉄金属または非鉄合金の物理的構造の変化
1非鉄金属または合金の熱処理によるか熱間または冷間加工による物理的構造の変化
16上記以外の金属またはそれを基とする合金
18高融点金属,耐火金属またはそれらを基とする合金
B21J 1/02
B処理操作;運輸
21本質的には材料の除去が行なわれない機械的金属加工;金属の打抜き
J鍛造;ハンマーリング;金属のプレス;リベット締め;鍛造炉
1金属材料の調整
02特定の形に変形しない金属素材の前処理,例.偏折域の改善,素材の荒鍛造またはプレス加工
CPC
B21J 1/02
BPERFORMING OPERATIONS; TRANSPORTING
21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
JFORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
1Preparing metal stock ; or similar ancillary operations prior, during or post forging, e.g. heating or cooling
02Preliminary treatment of metal stock without particular shaping, e.g. salvaging segregated zones, forging or pressing in the rough
C23C 14/3414
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
3407Cathode assembly for sputtering apparatus, e.g. Target
3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
C22F 1/18
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
16of other metals or alloys based thereon
18High-melting or refractory metals or alloys based thereon
出願人 JX Nippon Mining & Metals Corporation
JX Nippon Mining & Materials Corporation
発明者 Kotaro Nagatsu
Shinichiro Senda
代理人 Howson & Howson LLP
優先権情報 2015-104295 22.05.2015 JP
発明の名称
(EN) Tantalum sputtering target, and production method therefor
front page image
要約
(EN)

Provided is a tantalum sputtering target, which includes an area ratio of crystal grains of which a {111} plane is oriented in a direction normal to a rolling surface (ND) is 35% or more when the ND, which is a cross section orthogonal to a sputtering surface of a target, is observed via Electron Backscatter Diffraction Pattern method. The object of the present invention is to provide a tantalum sputtering target in which a sputtered material can be uniformly deposited on a wafer surface under high-power sputtering conditions by increasing the straightness of the sputtered material. By using this kind of tantalum target for sputter-deposition, it is possible to improve the film thickness uniformity and the throughput of deposition even for fine wiring.
関連特許文献
EP3260572
KR1020170127548
CN107532287
SG11201708112T
JPWO2016190159
WO/2016/190159
IL255349
# -