(EN)
87
ABSTRACT
A tape for semiconductor processing that can be caused
to shrink by heating sufficiently in a short time period and
can retain a kerf width is provided.
A tape for semiconductor processing 10 of the invention
includes a temporary adhesive tape 15 having a substrate film
11; and a temporary adhesive layer 12 formed on at least one
surface side of the substrate film 11, in which regarding the
temporary adhesive tape 15, the sum of the integral value
calculated from the sum total of the values of the thermal
deformation rate in any of a first direction per 1°C between
40°C and 80°C measured at the time of raising temperature by
means of a thermomechanical characteristics testing machine,
and the integral value calculated from the sum total of the
values of the thermal deformation rate in a second direction
perpendicular to the first direction per 1°C between 40°C and
80°C measured at the time of raising temperature by means of
a thermomechanical characteristics testing machine, is a
negative value.