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1. SG11201709041U - SEALING RESIN SHEET FOR SUBSTRATE HAVING ELECTRONIC COMPONENT BUILT THEREIN AND METHOD FOR MANUFACTURING SUBSTRATE HAVING ELECTRONIC COMPONENT BUILT THEREIN

官庁
シンガポール
出願番号 11201709041U
出願日 18.04.2016
公開番号 11201709041U
公開日 28.12.2017
公報種別 A1
IPC
H05K 3/46
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
46多重層回路の製造
H01L 23/29
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
29材料に特徴のあるもの
H01L 23/31
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
31配列に特徴のあるもの
CPC
H01L 2224/96
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
96the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
H05K 3/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
H05K 1/0313
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
H05K 3/281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
281by means of a preformed insulating foil
出願人 NITTO DENKO CORPORATION
発明者 SHIGA, Goji
IINO, Chie
優先権情報 2015104111 22.05.2015 JP
発明の名称
(EN) SEALING RESIN SHEET FOR SUBSTRATE HAVING ELECTRONIC COMPONENT BUILT THEREIN AND METHOD FOR MANUFACTURING SUBSTRATE HAVING ELECTRONIC COMPONENT BUILT THEREIN
要約
(EN) 38 ABSTRACT The present invention provides a sealing resin sheet for a substrate having an electronic component built therein, which has an easily controllable linear expansion coefficient a nd can suppress the occurrence of voids during its production . The present invention relates to a sealing resin sheet for a substrate having an electronic component built therein . The sealing resin sheet has a single layer structure having a thickness of 150 m m or more and 1000 m m or less, and has a linear expansion coefficient of 10 ppm/K or more and 28 ppm/K or less after a heat treatment at 150 ° C for 1 hour . It is preferable that the sealing resin sheet for a substrate having an electronic component b uilt therein includes an inorganic filler having an average particle diameter of 0.5 m m to 5 m m , and a content of the inorganic filler is 70 to 87% by weight.