(EN)
38
ABSTRACT
The present invention provides a sealing resin sheet for
a substrate having an electronic component built therein, which
has an easily controllable linear expansion coefficient a nd can
suppress the occurrence of voids during its production . The
present invention relates to a sealing resin sheet for a
substrate having an electronic component built therein . The
sealing resin sheet has a single layer structure having a
thickness of 150 m m or more and 1000 m m or less, and has a linear
expansion coefficient of 10 ppm/K or more and 28 ppm/K or less
after a heat treatment at 150 ° C for 1 hour . It is preferable
that the sealing resin sheet for a substrate having an
electronic component b uilt therein includes an inorganic filler
having an average particle diameter of 0.5 m m to 5 m m , and a
content of the inorganic filler is 70 to 87% by weight.