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出願の表示

1. MYPI 2019003945 - TAPE FOR SEMICONDUCTOR PROCESSING

官庁 マレーシア
出願番号 PI 2019003945
出願日 18.07.2018
公開番号 PI 2019003945
公開日 28.09.2019
公報種別 A
IPC
H
H電気
C
C化学;冶金
C
C化学;冶金
出願人 FURUKAWA ELECTRIC CO., LTD.
発明者 SANO, Toru
SENDAI, Akira
HASHIMOTO, Kosuke
代理人 RAMAKRISHNA DAMODHARAN
優先権情報 2018061061 28.03.2018 JP
発明の名称
(EN) TAPE FOR SEMICONDUCTOR PROCESSING
要約
(EN)
A tape for semiconductor processing that can be caused to shrink by heating sufficiently in a short time period and can retain a kerf width is provided. A tape for semiconductor processing 10 of the invention includes a temporary adhesive tape 15 having a substrate film 11; and a temporary adhesive layer 12 formed on at least one surface side of the substrate film 11, in which regarding the temporary adhesive tape 15, the sum of the integral value calculated from the sum total of the values of the thermal deformation rate in any of a first direction per 1�C between 40�C and 80�C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, and the integral value calculated from the sum total of the values of the thermal deformation rate in a second direction perpendicular to the first direction per 1�C between 40�C and 80�C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, is a negative value.