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1. KR1020070059000 - ELECTRONIC DEVICE AND PACKAGE USED FOR THE SAME

官庁 大韓民国
出願番号 1020067008070
出願日 26.04.2006
公開番号 1020070059000
公開日 11.06.2007
公報種別 A
IPC
H 電気
03
基本電子回路
H
インビーダンス回路網,例.共振回路;共振器
9
電気機械的または電気音響的素子を含む回路網;電気機械的共振器
25
弾性表面波を使用する共振器の構造上の特徴
CPC
H03H 9/0576
H01L 24/06
H01L2224/05553
H01L2224/05554
H01L2224/0603
H01L2224/48091
出願人 SANYO ELECTRIC CO., LTD.
산요덴키가부시키가이샤
発明者 NAGANO NATSUYO
나가노 나츠요
OGURA TAKASHI
오구라 타카시
代理人 황의인
優先権情報 JP-P-2004-00286398 30.09.2004 JP
発明の名称
(EN) ELECTRONIC DEVICE AND PACKAGE USED FOR THE SAME
(KO) 전자 디바이스 및 이것에 이용하는 패키지
要約
(EN)

[PROBLEMS] To provide a stacked ceramic electronic device applicable to two types of design specifications by using a common package. [MEANS FOR SOLVING PROBLEMS] In a stacked ceramic electronic device, filter chips (2, 3) for transmission and reception are mounted. A wiring pattern (7), which connects an input terminal (A) of a transmission filter chip (2) with a transmission side signal terminal (Tx) in a first arrangement embodiment, is provided with two branch wiring parts (72, 73) extending from the transmission side signal terminal (Tx) toward the input terminal (A) of the transmission filter chip (2) in the first arrangement embodiment and toward an output terminal (D) of a reception filter chip (3) in a second arrangement embodiment. A wiring pattern (8), which connects the output terminal (D) of the reception filter chip (3) with the reception side signal terminal (Rx) in the first arrangement embodiment, is provided with two branch wiring parts (82, 83) extending from the reception side signal terminal (Rx) toward the output terminal (D) of the reception filter chip (3) in the first arrangement embodiment and toward the input terminal (A) of the transmission filter chip (2) in the second arrangement embodiment.

© KIPO & WIPO 2007

(KO)
공통의 패키지를 이용하여 두 종류의 설계 사양에 대응 가능한 적층 세라믹형 전자 디바이스를 제공한다.