ご意見送信
設定

設定

出願の表示

1. KR1020160006784 - 수지 몰드 장치 및 수지 몰드 방법

パーマリンク
官庁 大韓民国
出願番号 1020157035214
出願日 11.04.2014
公開番号 1020160006784
公開日 19.01.2016
特許番号 102189199
特許付与日 09.12.2020
公報種別 B1
IPC
H01L 21/56
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
50サブグループH01L21/06~H01L21/326の一つに分類されない方法または装置を用いる半導体装置の組立
56封緘,例.封緘層,被覆
B29C 43/18
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
Cプラスチックの成形または接合;他に分類されない可塑状態の材料の成形;成形品の後処理,例.補修
43圧縮成形,すなわち付加された外部圧で成形材料を流動させるもの;そのための装置
02一定長の物品,すなわち.不連続物品,の圧縮成形
18あらかじめ形成された部品または層状物品と一体化するもの,例.挿入物の周囲へまたは物品を被覆するための
B29C 43/58
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
Cプラスチックの成形または接合;他に分類されない可塑状態の材料の成形;成形品の後処理,例.補修
43圧縮成形,すなわち付加された外部圧で成形材料を流動させるもの;そのための装置
32構成部品,細部または付属装置;補助操作
58計量,制御または調整
B29C 45/02
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
Cプラスチックの成形または接合;他に分類されない可塑状態の材料の成形;成形品の後処理,例.補修
45射出成形,即ち所要量の成形材料をノズルを介して閉鎖型内へ流入させるもの;そのための装置
02トランスファー成形,即ち所要量の成形材料をプランジャによってショットキャビティから型キャビティへ移送するもの
B29C 45/14
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
Cプラスチックの成形または接合;他に分類されない可塑状態の材料の成形;成形品の後処理,例.補修
45射出成形,即ち所要量の成形材料をノズルを介して閉鎖型内へ流入させるもの;そのための装置
14あらかじめ形成された部品または層状物品と一体化するもの,例.挿入物の周囲へまたは物品を被覆するための射出成形
B29C 45/26
B処理操作;運輸
29プラスチックの加工;可塑状態の物質の加工一般
Cプラスチックの成形または接合;他に分類されない可塑状態の材料の成形;成形品の後処理,例.補修
45射出成形,即ち所要量の成形材料をノズルを介して閉鎖型内へ流入させるもの;そのための装置
17構成部品,細部または付属装置;補助操作
26金型
CPC
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
B29C 43/18
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
02of articles of definite length, i.e. discrete articles
18incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 45/02
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
B29C 69/02
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
69Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
02of moulding techniques only
H01L 21/561
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
561Batch processing
B29C 2043/5825
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
43Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
32Component parts, details or accessories; Auxiliary operations
58Measuring, controlling or regulating
5825dimensions or shape, e.g. size, thickness
出願人 아피쿠 야마다 가부시키가이샤
発明者 사토 히사시
도후쿠지 시게유키
가와구치 마코토
代理人 특허법인(유)화우
優先権情報 2013101579 13.05.2013 JP
発明の名称
(KO) 수지 몰드 장치 및 수지 몰드 방법
front page image
要約
(KO)
하나의 수지 몰드 장치에 있어서 트랜스퍼 성형 및 압축 성형을 자유롭게 실시할 수 있는 기술을 제공하는 것을 과제로 한다. 해결 수단으로서, 제어부(130)는, 트랜스퍼 성형을 행하게 하는 성형 처리와 압축 성형을 행하게 하는 성형 처리를 선택적으로 실행 가능하게 구성되고, 또, 외부 입력 결과에 의거하여 선택되어 설정된 성형 처리를 실행하도록 구성된다. 트랜스퍼 성형 처리에서는, 트랜스퍼 성형용의 수지를 포트에 공급시키고, 플런저에 의해 트랜스퍼 성형용의 수지를 캐비티에 압송시키는 처리를 실행하고, 압축 성형 처리에서는, 압축 성형용의 수지를 캐비티에 공급시키는 처리를 실행한다. 수지 공급부(120)는, 선택된 성형 처리에 따라서, 트랜스퍼 성형용의 수지와 압축 성형용의 수지를 선택적으로 몰드 금형에 대하여 공급 가능하게 구성된다.
他の公開
CN105228805
JP2014222711
WO/2014/185202
# -