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1. KR1020120087989 - 레이저 모듈

官庁 大韓民国
出願番号 1020127015542
出願日 16.12.2010
公開番号 1020120087989
公開日 07.08.2012
公報種別 A
IPC
H01S 5/022
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
02レーザ作用にとって本質的ではない構造的な細部または構成
022マウント;ハウジング
H01S 5/024
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
02レーザ作用にとって本質的ではない構造的な細部または構成
024冷却装置
CPC
H01S 5/02476
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Cooling arrangements
02476Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
H01L2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01S 5/02272
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
02236Mounts or sub-mounts
02256Details of fixing the laser diode on the mount
02272using soldering
H01S 5/02276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
02236Mounts or sub-mounts
02276Wire-bonding details
H01S 5/4031
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
4031Edge-emitting structures
出願人 미쓰비시덴키 가부시키가이샤
発明者 다마야 모토아키
난바 치세
야나기사와 다카유키
오에 신이치
야마모토 슈헤이
요코야마 아키라
代理人 제일특허법인
優先権情報 JP-P-2009-287703 18.12.2009 JP
発明の名称
(KO) 레이저 모듈
要約
(KO)
LD 어레이를 저응력이고 또한 적절한 온도로 구동하는 것이 가능한 저가의 모듈 구조를 얻는다. 접촉하는 부재로부터의 열을 방열하는 히트 싱크(3)와, 히트 싱크(3)상에 배치되어, 절연 재료로 구성된 서브마운트 기판(4)과, 서브마운트 기판(4)상에 배치되는 급전층(5A)과, 급전층(5A)상에 병렬 배치되는 복수의 발광부를 갖는 반도체 레이저 어레이(6)를 구비하며, 서브마운트 기판(4)의 선팽창 계수를 반도체 레이저 어레이(6)의 선팽창 계수보다도 작게 하고, 반도체 레이저 어레이(6)보다도 큰 선팽창 계수를 갖는 히트 싱크(3)와 접속된 상태에서의 서브마운트 기판(4)의 선팽창 계수가, 반도체 레이저 어레이(6)의 선팽창 계수를 포함하는 소정의 범위 내로 되도록 했다.