処理中

しばらくお待ちください...

設定

設定

出願の表示

1. JP2022045535 - 面発光レーザ装置、電子機器及び面発光レーザ装置の製造方法

官庁
日本
出願番号 2020151177
出願日 09.09.2020
公開番号 2022045535
公開日 22.03.2022
公報種別 A
IPC
H01S 5/022
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
02レーザ作用にとって本質的ではない構造的な細部または構成
022マウント;ハウジング
H01S 5/42
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
40H01S5/02~H01S5/30に分類されない2個以上の半導体レーザの配列
42表面放出型レーザの配列
H01S 5/183
H電気
01基本的電気素子
S光を増幅または生成するために,放射の誘導放出による光増幅を用いた装置;光領域以外の電磁放射の誘導放出を用いた装置
5半導体レーザ
10光共振器の構造または形状
18表面放出型レーザ[7]
183垂直共振器を有するもの[7]
CPC
H01S 5/183
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
10Construction or shape of the optical resonator ; , e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
183having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
H01S 5/42
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
42Arrays of surface emitting lasers
H01S 5/022
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
H01S 5/0233
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0233Mounting configuration of laser chips
H01S 5/0239
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0239Combinations of electrical or optical elements
出願人 SONY SEMICONDUCTOR SOLUTIONS CORP
ソニーセミコンダクタソリューションズ株式会社
発明者 OTOMO JUGO
御友 重吾
代理人 渡邊 薫
発明の名称
(EN) SURFACE EMITTING LASER DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF SURFACE EMITTING LASER DEVICE
(JA) 面発光レーザ装置、電子機器及び面発光レーザ装置の製造方法
要約
(EN)

PROBLEM TO BE SOLVED: To provide a surface emitting laser device capable of suppressing variation in a distance between an element unit and a driver unit while suppressing damage to the element unit.

SOLUTION: A surface emitting laser device 1 includes an element arrangement area EA in which a plurality of surface emitting laser elements 100 are arranged, an element unit 10 including an adjacent area AA adjacent to the element arrangement area, a driver unit 20 including a driver IC, a plurality of first bumps BP1 for individually joining each of the plurality of surface emitting laser elements and the driver unit, and a plurality of second bumps BP2 joining the adjacent area and the driver unit, and each of the plurality of first bumps and the plurality of second bumps contains a conductive material that is less likely to be crushed by pressure, and the plurality of second bumps are arranged at a higher density than the plurality of first bumps.

SELECTED DRAWING: Figure 2

COPYRIGHT: (C)2022,JPO&INPIT


(JA) 【課題】素子ユニットの破損を抑制しつつ、素子ユニットとドライバユニットとの間隔のばらつきを抑制できる面発光レーザ装置を提供する。
【解決手段】複数の面発光レーザ素子100が配置された素子配置領域EAと、素子配置領域に隣接する隣接領域AAとを含む素子ユニット10と、ドライバICを含むドライバユニット20と、複数の面発光レーザ素子の各々とドライバユニットとを個別に接合する複数の第1のバンプBP1と、隣接領域とドライバユニットとを接合する複数の第2のバンプBP2と、を備え、複数の第1のバンプ及び複数の第2のバンプの各々は、加圧により潰れにくくなる導電性材料を含み、複数の第2のバンプは、複数の第1のバンプよりも高密度に配置されている、面発光レーザ装置1。
【選択図】図2

関連特許文献