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1. JPWO2019043864 - 端面入射型受光素子

官庁
日本
出願番号 2019538844
出願日 31.08.2017
公開番号 WO2019043864
公開日 07.03.2019
特許番号 6945633
特許付与日 16.09.2021
公報種別 B2
IPC
H01L 31/0232
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
31赤外線,可視光,短波長の電磁波,または粒子線輻射に感応する半導体装置で,これらの輻射線エネルギーを電気的エネルギーに変換するかこれらの輻射線によって電気的エネルギーを制御かのどちらかに特に適用されるもの;それらの装置またはその部品の製造または処理に特に適用される方法または装置;それらの細部
02細部
0232装置と結合した光学素子または光学装置
CPC
H01L 31/02327
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0232Optical elements or arrangements associated with the device
02327the optical elements being integrated or being directly associated to the device, e.g. back reflectors
H01L 31/035281
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
0248characterised by their semiconductor bodies
0352characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
035272characterised by at least one potential jump barrier or surface barrier
035281Shape of the body
G02B 6/4214
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4204the coupling comprising intermediate optical elements, e.g. lenses, holograms
4214the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
G02B 6/4225
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
4225by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
G02B 6/4286
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4286Optical modules with optical power monitoring
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
出願人 株式会社京都セミコンダクター
発明者 大村 悦司
磯村 尚友
臼井 健
代理人 立花 顕治
山下 未知子
桝田 剛
発明の名称
(JA) 端面入射型受光素子
要約
(JA)

本開示の一側面に係る端面入射型受光素子は、半導体材料で構成され、垂直方向に対向する上面及び下面と、上面及び下面の端部同士を連結し、光を照射する光源側に配置される端面と、を備える。端面の少なくとも一部分は、上面側よりも下面側が光源に近付くように垂直方向に対して傾斜している。下面には、1又は複数の溝が設けられる。1又は複数の溝の前記端面側の斜面は、光源から端面を介して入射した光を反射するように配置される。上面側には、1又は複数の溝の端面側の斜面で反射された光を受光する受光領域が設けられる。


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