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1. JP2016219638 - 電子部品内蔵基板用封止樹脂シート及び電子部品内蔵基板の製造方法

官庁
日本
出願番号 2015104111
出願日 22.05.2015
公開番号 2016219638
公開日 22.12.2016
公報種別 A
IPC
H05K 3/46
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
46多重層回路の製造
H01L 23/29
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
29材料に特徴のあるもの
H01L 23/31
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
31配列に特徴のあるもの
CPC
H01L 2224/96
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
96the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
H05K 3/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
H05K 1/0313
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
H05K 3/281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
281by means of a preformed insulating foil
出願人 NITTO DENKO CORP
日東電工株式会社
発明者 SHIGA GOSHI
志賀 豪士
IINO CHIE
飯野 智絵
代理人 特許業務法人 ユニアス国際特許事務所
発明の名称
(EN) ENCAPSULATION RESIN SHEET FOR ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT BUILT-IN SUBSTRATE
(JA) 電子部品内蔵基板用封止樹脂シート及び電子部品内蔵基板の製造方法
要約
(EN)

PROBLEM TO BE SOLVED: To provide an encapsulation resin sheet for electronic component built-in substrate, capable of facilitating control of a linear expansion coefficient and suppressing generation of a void during its manufacture.

SOLUTION: The present invention relates to an encapsulation resin sheet for electronic component built-in substrate which has a single layer structure with a thickness of 150 μm to 1000 μm and a linear expansion coefficient of 10 ppm/K to 28 ppm/K after one-hour heat treatment at 150°C. The encapsulation resin sheet for electronic component built-in substrate includes an inorganic filler with an average particle diameter of 0.5 μm to 5 μm and desirably a content of the inorganic filler is 70 to 87 wt%.

SELECTED DRAWING: Figure 1F

COPYRIGHT: (C)2017,JPO&INPIT


(JA)

【課題】 線膨張係数の制御が容易で、かつ作製時のボイドの発生を抑制可能な電子部品内蔵基板用封止樹脂シートを提供すること。
【解決手段】 本発明は、厚さが150μm以上1000μm以下の単層構造を有し、150℃で1時間熱処理した後の線膨張係数が10ppm/K以上28ppm/K以下である電子部品内蔵基板用封止樹脂シートに関する。電子部品内蔵基板用封止樹脂シートは、平均粒径が0.5μm〜5μmである無機充填剤を含み、前記無機充填剤の含有量が70〜87重量%であることが好ましい。
【選択図】 図1F