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1. JP2015025198 - 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法

官庁
日本
出願番号 2014115146
出願日 03.06.2014
公開番号 2015025198
公開日 05.02.2015
特許番号 5648232
特許付与日 21.11.2014
公報種別 B1
IPC
C23C 18/30
C化学;冶金
23金属質材料への被覆;金属質材料による材料への被覆;化学的表面処理;金属質材料の拡散処理;真空蒸着,スパッタリング,イオン注入法,または化学蒸着による被覆一般;金属質材料の防食または鉱皮の抑制一般
C金属質への被覆;金属材料による材料への被覆;表面への拡散,化学的変換または置換による,金属材料の表面処理;真空蒸着,スパッタリング,イオン注入法または化学蒸着による被覆一般
18液状化合物または溶液のいずれかからなる被覆形成化合物の分解による化学的被覆であって表面材料の反応生成物を被覆層中に残さないもの;接触メッキ
16還元または置換によるもの,例.無電解メッキ
18被覆される材料の前処理
20有機質表面の前処理,例.樹脂
28増感処理または活性化処理
30活性化処理
B01J 31/06
B処理操作;運輸
01物理的または化学的方法または装置一般
J化学的または物理的方法,例.触媒またはコロイド化学;それらの関連装置
31水素化物,配位錯体または有機化合物からなる触媒(重合反応においてのみ使用される触媒組成物C08)
02有機化合物または金属水素化物を含有するもの
06重合体を含有するもの
B01J 37/02
B処理操作;運輸
01物理的または化学的方法または装置一般
J化学的または物理的方法,例.触媒またはコロイド化学;それらの関連装置
37触媒調製のためのプロセス一般;触媒の活性化のためのプロセス一般
02含浸,被覆または沈澱
CPC
C23C 18/1893
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1851of surfaces of non-metallic or semiconducting in organic material
1872by chemical pretreatment
1886Multistep pretreatment
1893with use of organic or inorganic compounds other than metals, first
C23C 18/2086
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
2006by other methods than those of C23C18/22 - C23C18/30
2046by chemical pretreatment
2073Multistep pretreatment
2086with use of organic or inorganic compounds other than metals, first
C23C 18/38
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
38Coating with copper
C23C 18/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
30Activating ; or accelerating or sensitising with palladium or other noble metal
H05K 3/181
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
181by electroless plating
C23C 18/1633
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
出願人 DIC CORP
DIC株式会社
OKUNO CHEM IND CO LTD
奥野製薬工業株式会社
発明者 FUKAZAWA NORIMASA
深澤 憲正
SHINBAYASHI AKITA
新林 昭太
SEKINE NOBUHIRO
関根 信博
SANO YOSHIYUKI
佐野 義之
MORIWAKI MASAYUKI
森脇 雅幸
KAWAMURA KAORI
河村 香
OTSUKA KUNIAKI
大塚 邦顕
KYO TOSHIYUKI
姜 俊行
MORIGUCHI TOMO
森口 朋
代理人 志賀 正武
高橋 詔男
渡邊 隆
鈴木 三義
村山 靖彦
優先権情報 2013131013 21.06.2013 JP
発明の名称
(EN) ELECTROLESS PLATING CATALYST, METAL FILM USING THE SAME AND METHOD FOR MANUFACTURING METAL FILM
(JA) 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法
要約
(EN)

PROBLEM TO BE SOLVED: To provide an electroless plating catalyst excellent in stability, capable of showing a sufficient adsorption amount only by simple immersion operation and exhibiting catalyst activity after performing generally cationized surface treatment to a useful object to be plated in the small number of steps, and a method for manufacturing a metal film using the electroless plating catalyst.

SOLUTION: The electroless plating catalyst is a composite of a compound obtained by polymerizing a monomeric mixture including a (meth)acrylic acid based monomer having one or more kinds of anionic functional groups selected from a group consisting of a carboxy group, a phosphoric acid group, a phosphorous acid group, a sulfonic acid group, a sulfinic acid group and a sulfenic acid group, with metal nano particles. A metal film is obtained using the electroless plating catalyst.

COPYRIGHT: (C)2015,JPO&INPIT


(JA)

【課題】少ない工程数で、有用な被めっき物に対して、一般的なカチオン化表面処理を施した後、単純な浸漬操作のみで充分な吸着量を示し、かつ触媒活性を発現する、安定性に優れた無電解めっき用触媒、及び、当該無電解めっき用触媒を用いた金属皮膜の製造方法を提供すること。
【解決手段】カルボキシ基、リン酸基、亜リン酸基、スルホン酸基、スルフィン酸基及びスルフェン酸基からなる群から選ばれる1種以上のアニオン性官能基を有する(メタ)アクリル酸系単量体を含有する単量体混合物を重合してなる化合物と、金属ナノ粒子との複合体である無電解めっき用触媒、ならびに、前記無電解めっき用触媒を用いて得られる金属皮膜。
【選択図】図1