(EN) PROBLEM TO BE SOLVED: To provide a chip resistor and its manufacturing method, in which solder bond strength is easy to assure even if mounted with sideways posture, and there is no possibility of protruding the housing recess of positioning tool in packaging process, moreover accelerating of miniaturization is not disturbed and the appearance of the chip resistor is good.
SOLUTION: When a chip resistor 10 is manufactured, a surface electrode 12 and a resistor 13 are formed on the surface 20a of a large-sized substrate 20, and a rear face electrode 16 is formed on the rear face 20b of the large-sized substrate 20. When this rear face electrode is formed, the rear face electrode 16 is extended in the inclined plane of V shaped groove which exists in the rear face 20b as a secondary splitting groove 22, and this extended portion is made to be a side face electrode 16a. And, the large-sized substrate 20 is divided in the shape of a strip along primary splitting grooves 21, after forming an end face electrode 17 in the divided plane by sputtering, by plating processing of the split substrate 24 along with the secondary splitting groove 22, the chip resistor 10 having the shape of right squuare pole exposing electrodes on the each side face is obtained.
COPYRIGHT: (C)2007,JPO&INPIT
【課題】 横向きの姿勢で実装されても半田接続強度が確保しやすく、かつ、実装過程で位置決め用治具の収納凹所からはみ出す虞がなく、しかも、小型化の促進を妨げず外観も良好なチップ抵抗器およびその製造方法を提供すること。
【解決手段】 チップ抵抗器１０を製造する際に、大判基板２０の表面２０ａに表面電極１２と抵抗体１３とを形成し、かつ、大判基板２０の裏面２０ｂに裏面電極１６を形成するが、この裏面電極形成時に、二次分割溝２２として裏面２０ｂに存するＶ字溝の傾斜面に裏面電極１６を延在させ、この延在部を側面電極１６ａとなす。そして、大判基板２０を一次分割溝２１に沿って短冊状に分割し、その分割面にスパッタリングによって端面電極１７を形成した後、短冊状基板２４を二次分割溝２２に沿って分割してメッキ処理することにより、ほぼ正四角柱状で各側面に電極を露出させたチップ抵抗器１０が得られる。
【選択図】 図１