(EN) A semiconductor device (1) is manufactured which includes a SiC epitaxial layer (28), a plurality of transistor cells (18) that are formed in the SiC epitaxial layer (28) and that are subjected to ON/OFF control by a predetermined control voltage, a gate electrode (19) that faces a channel region (32) of the transistor cells (18) in which a channel is formed when the semiconductor device (1) is inan ON state, a gate metal (44) that is exposed at the topmost surface for electrical connection with the outside and that is electrically connected to the gate electrode (19) while being physically separated from the gate electrode (19), and a built-in resistor (21) that is made of polysilicon and that is disposed below the gate metal (44) so as to electrically connect the gate metal (44) and thegate electrode (19) together.
(ZH) 形成半导体装置(1),所述半导体装置包含:SiC外延层(28);多个晶体管单元(18),形成于SiC外延层(28),通过规定的控制电压接通/关断控制;栅极电极(19),与在接通时形成沟道的晶体管单元(18)的沟道区域(32)相对;栅极金属(44),为了与外部的电连接而露出到最外层表面,与栅极电极(19)在物理上分离,但是,电连接于栅极电极(19);以及内置电阻(21),被配置在栅极金属(44)的下方,由将栅极金属(44)和栅极电极(19)电连接的多晶硅构成。