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出願の表示

1. CN110546738 - SEMICONDUCTOR PROCESSING TAPE

官庁 中華人民共和国
出願番号 201880005343.3
出願日 18.07.2018
公開番号 110546738
公開日 06.12.2019
特許番号 110546738
特許付与日 29.12.2020
公報種別 B
IPC
H01L 21/301
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
18不純物,例.ドーピング材料,を含むまたは含まない周期表第IV族の元素またはA↓I↓I↓IB↓V化合物から成る半導体本体を有する装置
30H01L21/20~H01L21/26に分類されない方法または装置を用いる半導体本体の処理
301半導体本体を別個の部品に細分割するため,例.分離する
C09J 7/22
C化学;冶金
09染料;ペイント;つや出し剤;天然樹脂;接着剤;他に分類されない組成物;他に分類されない材料の応用
J接着剤;接着方法一般の非機械的観点;他に分類されない接着方法;物質の接着剤としての使用
7フィルム状または箔状の接着剤
20担体に特徴のあるもの
22プラスチック;金属化プラスチック
C09J 7/38
C化学;冶金
09染料;ペイント;つや出し剤;天然樹脂;接着剤;他に分類されない組成物;他に分類されない材料の応用
J接着剤;接着方法一般の非機械的観点;他に分類されない接着方法;物質の接着剤としての使用
7フィルム状または箔状の接着剤
30接着剤組成物に特徴のあるもの
38感圧性接着剤
CPC
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/20
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
C09J 7/22
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
22Plastics; Metallised plastics
C09J 7/38
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives [PSA]
H01L 2224/27
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
27Manufacturing methods
H01L 2224/83191
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
8319Arrangement of the layer connectors prior to mounting
83191wherein the layer connectors are disposed only on the semiconductor or solid-state body
出願人 FURUKAWA ELECTRIC CO LTD
古河电气工业株式会社
発明者 HASHIMOTO KOSUKE
桥本浩介
SENDAI AKIRA
仙台晃
SANO TORU
佐野透
代理人 中科专利商标代理有限责任公司 11021
優先権情報 2018061061 28.03.2018 JP
発明の名称
(EN) SEMICONDUCTOR PROCESSING TAPE
(ZH) 半导体加工用带
要約
(EN)
A semiconductor processing tape is provided which enables obtaining sufficient thermal shrinkage in a short period of time and which enables maintaining curve width. This semiconductor processing tape10 is characterized by comprising an adhesive tape 15 that comprises a substrate film 11 and an adhesive layer 12 formed on at least one side of the substrate film 11, wherein the adhesive tape 15 issuch that the sum of the integral value calculated with the sum of the thermal deformation rate every 1 DEG C between 40 DEG C and 80 DEG C measured while the temperature is rising by a thermo-mechanical property tester in a first direction, and the integral value calculated with the sum of the thermal deformation ratio every 1 DEG C between 40 DEG C and 80 DEG C measured while the temperature isrising by a thermomechanical property tester in a second direction that forms a right angle with the aforementioned first direction is a negative value.

(ZH)
本发明提供能够在短时间充分加热收缩且能够保持切口(kerf)宽度的半导体加工用带。本发明的半导体加工用带(10)的特征为具有粘合带(15),该粘合带(15)具有基材膜(11)及形成于所述基材膜(11)的至少一面侧的粘合剂层(12),所述粘合带(15)以于任意第一方向的利用热机械特性试验机于升温时测定的40℃~80℃之间的每1℃的热变形率的总和算出的积分值与以于与所述第一方向成直角的第二方向的利用热机械特性试验机于升温时测定的40℃~80℃之间的每1℃的热变形率的总和算出的积分值之和为负值。