(EN) A semiconductor processing tape is provided which enables obtaining sufficient thermal shrinkage in a short period of time and which enables maintaining curve width. This semiconductor processing tape10 is characterized by comprising an adhesive tape 15 that comprises a substrate film 11 and an adhesive layer 12 formed on at least one side of the substrate film 11, wherein the adhesive tape 15 issuch that the sum of the integral value calculated with the sum of the thermal deformation rate every 1 DEG C between 40 DEG C and 80 DEG C measured while the temperature is rising by a thermo-mechanical property tester in a first direction, and the integral value calculated with the sum of the thermal deformation ratio every 1 DEG C between 40 DEG C and 80 DEG C measured while the temperature isrising by a thermomechanical property tester in a second direction that forms a right angle with the aforementioned first direction is a negative value.
(ZH) 本发明提供能够在短时间充分加热收缩且能够保持切口(kerf)宽度的半导体加工用带。本发明的半导体加工用带(10)的特征为具有粘合带(15)，该粘合带(15)具有基材膜(11)及形成于所述基材膜(11)的至少一面侧的粘合剂层(12)，所述粘合带(15)以于任意第一方向的利用热机械特性试验机于升温时测定的40℃～80℃之间的每1℃的热变形率的总和算出的积分值与以于与所述第一方向成直角的第二方向的利用热机械特性试验机于升温时测定的40℃～80℃之间的每1℃的热变形率的总和算出的积分值之和为负值。