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1. CN110476237 - SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

パーマリンク
官庁
中華人民共和国
出願番号 201880020569.0
出願日 21.08.2018
公開番号 110476237
公開日 19.11.2019
公報種別 A
IPC
H01L 21/60
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
02半導体装置またはその部品の製造または処理
04少なくとも一つの電位障壁または表面障壁,例.PN接合,空乏層,キャリア集中層,を有する装置
50サブグループH01L21/06~H01L21/326の一つに分類されない方法または装置を用いる半導体装置の組立
60動作中の装置にまたは装置から電流を流すためのリードまたは他の導電部材の取り付け
B23K 26/18
B処理操作;運輸
23工作機械;他に分類されない金属加工
Kハンダ付またはハンダ離脱;溶接;ハンダ付または溶接によるクラッドまたは被せ金;局部加熱による切断,例.火炎切断:レーザービームによる加工
26レーザービームによる加工,例.溶接,切断または穴あけ
18加工物に吸収層を設けるもの,例.対象物をマーキングまたは保護するためのもの
B23K 26/21
B処理操作;運輸
23工作機械;他に分類されない金属加工
Kハンダ付またはハンダ離脱;溶接;ハンダ付または溶接によるクラッドまたは被せ金;局部加熱による切断,例.火炎切断:レーザービームによる加工
26レーザービームによる加工,例.溶接,切断または穴あけ
20接合
21溶接
H01L 23/48
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
48動作中の固体本体からまたは固体本体へ電流を導く装置,例.リードまたは端子装置
CPC
B23K 26/18
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
18using absorbing layers on the workpiece, e.g. for marking or protecting purposes
H01L 23/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
H01L 2224/49111
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4911the connectors being bonded to at least one common bonding area, e.g. daisy chain
49111the connectors connecting two common bonding areas, e.g. Litz or braid wires
B23K 26/244
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
21by welding
24Seam welding
244Overlap seam welding
B23K 26/242
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
21by welding
24Seam welding
242Fillet welding, i.e. involving a weld of substantially triangular cross section joining two parts
B23K 26/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
21by welding
24Seam welding
26of rectilinear seams
出願人 FUJI ELECTRIC CO., LTD.
富士电机株式会社
発明者 OKUMOTO RYOJI
奥本凌二
代理人 北京铭硕知识产权代理有限公司 11286
北京铭硕知识产权代理有限公司 11286
優先権情報 2017-202252 19.10.2017 JP
発明の名称
(EN) SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
(ZH) 半导体装置及半导体装置的制造方法
front page image
要約
(EN) In this invention, damage to the interior of a device is suppressed and wiring members are joined to one another appropriately. The invention comprises overlapping first and second wiring members (1a,2a), then, disposing a protective member (3) in an opposite region (7), which faces away from an irradiation region (6) of the overlapped first and second wiring members (1a, 2a) wherein a laser light (4) is irradiated. The protective member (3) has a higher melting point than that of the first and/or second wiring members (1a, 2a) constituting the opposite region (7). A laser light (4) is irradiated onto the irradiation region (6). In so doing, since the protective member (3) has a higher melting point than that of the first and/or second wiring members (1a, 2a) constituting the opposite region (7), the protective member (3) is not melted by the laser light (4). Therefore, the laser light (4) does not penetrate the protective member (3); in addition, scattering and dropping of molten pieces from a molten second wiring member (2a) are prevented.
(ZH) 本发明抑制装置内部的损伤而将布线部件间适当地接合。将第1布线部件、第2布线部件(1a、2a)重叠。然后，在重叠的第1布线部件、第2布线部件(1a、2a)的与照射有激光(4)的照射区域(6)对置的对置区域(7)配置有保护部件(3)。保护部件(3)的熔点比构成对置区域(7)的第1布线部件、第2布线部件(1a、2a)中的至少一方的熔点高。向该照射区域(6)照射激光(4)。此时，由于保护部件(3)的熔点比构成对置区域(7)的第1布线部件、第2布线部件(1a、2a)中的至少一方的熔点高，所以保护部件(3)不被激光(4)熔融。因此，激光(4)不会贯穿保护部件(3)，另外，防止熔融的第2布线部件(2a)的熔融片的飞散、落下。
関連特許文献
JPWO2019077866
WO/2019/077866
US20200023465
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