(EN) The present invention provides a sealing resin sheet for a substrate having an electronic component built therein, in which the linear expansion coefficient can be easily controlled and that can suppress the occurrence of a void during manufacturing. The present invention relates to a sealing resin sheet for a substrate having an electronic component built therein, the sealing resin sheet having asingle layer structure with a thickness of 150-1000 [mu]m inclusive and having a linear expansion coefficient of 10-28 ppm/K, inclusive, after being heat-treated for one hour at 150 DEG C. It is preferable that the sealing resin sheet for a substrate having an electronic component built therein contain an inorganic filler with an average particle diameter of 0.5-5 [mu]m and that the content of the inorganic filler be 70-87 weight%.
(ZH) 本发明提供一种线膨胀系数的控制容易、且能够抑制制作时的空孔的产生的电子部件内置基板用密封树脂片。本发明涉及一种电子部件内置基板用密封树脂片,其具有厚度为150μm以上且1000μm以下的单层结构,以150℃进行1小时热处理后的线膨胀系数为10ppm/K以上且28ppm/K以下。优选电子部件内置基板用密封树脂片包含平均粒径为0.5μm~5μm的无机填充剂,上述无机填充剂的含量为70~87重量%。