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1. CN107615899 - Sealing resin sheet for substrate having electronic component built therein and method for manufacturing substrate having electronic component built therein

官庁
中華人民共和国
出願番号 201680028440.5
出願日 18.04.2016
公開番号 107615899
公開日 19.01.2018
公報種別 A
IPC
H05K 3/46
H電気
05他に分類されない電気技術
K印刷回路;電気装置の箱体または構造的細部,電気部品の組立体の製造
3印刷回路を製造するための装置または方法
46多重層回路の製造
H01L 23/29
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
29材料に特徴のあるもの
H01L 23/31
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
23半導体または他の固体装置の細部
28封緘,例.封緘層,被覆
31配列に特徴のあるもの
CPC
H01L 2224/96
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
96the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
H05K 3/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
H05K 1/0313
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
H05K 3/281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
281by means of a preformed insulating foil
出願人 NITTO DENKO CORPORATION
発明者 SHIGA GOJI
IINO CHIE
優先権情報 2015104111 22.05.2015 JP
発明の名称
(EN) Sealing resin sheet for substrate having electronic component built therein and method for manufacturing substrate having electronic component built therein
(ZH) 电子部件内置基板用密封树脂片以及电子部件内置基板的制造方法
要約
(EN) The present invention provides a sealing resin sheet for a substrate having an electronic component built therein, in which the linear expansion coefficient can be easily controlled and that can suppress the occurrence of a void during manufacturing. The present invention relates to a sealing resin sheet for a substrate having an electronic component built therein, the sealing resin sheet having asingle layer structure with a thickness of 150-1000 [mu]m inclusive and having a linear expansion coefficient of 10-28 ppm/K, inclusive, after being heat-treated for one hour at 150 DEG C. It is preferable that the sealing resin sheet for a substrate having an electronic component built therein contain an inorganic filler with an average particle diameter of 0.5-5 [mu]m and that the content of the inorganic filler be 70-87 weight%.
(ZH) 本发明提供一种线膨胀系数的控制容易、且能够抑制制作时的空孔的产生的电子部件内置基板用密封树脂片。本发明涉及一种电子部件内置基板用密封树脂片,其具有厚度为150μm以上且1000μm以下的单层结构,以150℃进行1小时热处理后的线膨胀系数为10ppm/K以上且28ppm/K以下。优选电子部件内置基板用密封树脂片包含平均粒径为0.5μm~5μm的无机填充剂,上述无机填充剂的含量为70~87重量%。