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出願の表示

1. BR112019019521 - fita para processamento de semicondutores

官庁 ブラジル
出願番号 112019019521
出願日 18.07.2018
公開番号 112019019521
公開日 22.04.2020
公報種別 A2
IPC
H01L 21/00
H電気
01基本的電気素子
L半導体装置,他に属さない電気的固体装置
21半導体装置または固体装置またはそれらの部品の製造または処理に特に適用される方法または装置
C09J 7/00
C化学;冶金
09染料;ペイント;つや出し剤;天然樹脂;接着剤;他に分類されない組成物;他に分類されない材料の応用
J接着剤;接着方法一般の非機械的観点;他に分類されない接着方法;物質の接着剤としての使用
7フィルム状または箔状の接着剤
C09J 7/00
C化学;冶金
09染料;ペイント;つや出し剤;天然樹脂;接着剤;他に分類されない組成物;他に分類されない材料の応用
J接着剤;接着方法一般の非機械的観点;他に分類されない接着方法;物質の接着剤としての使用
7フィルム状または箔状の接着剤
CPC
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/20
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
C09J 7/22
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
22Plastics; Metallised plastics
C09J 7/38
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
30characterised by the adhesive composition
38Pressure-sensitive adhesives [PSA]
H01L 2224/27
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
27Manufacturing methods
H01L 2224/83191
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
8319Arrangement of the layer connectors prior to mounting
83191wherein the layer connectors are disposed only on the semiconductor or solid-state body
出願人 FURUKAWA ELECTRIC CO.,LTD.
発明者 AKIRA SENDAI
KOSUKE HASHIMOTO
TORU SANO
代理人 Clarke, Modet Propriedade Intelectual Ltda.
優先権情報 2018061061 28.03.2018 JP
発明の名称
(PT) fita para processamento de semicondutores
要約
(PT)
é fornecida uma fita para processamento de semicondutores que pode ser induzida a retrair por aquecer suficientemente em um curto período de tempo e pode reter uma largura de corte.uma fita para processamento de semicondutores 10 da invenção inclui uma fita adesiva temporária 15 tendo uma película de substrato 11; e uma camada adesiva temporária 12 formada em pelo menos um lado da superfície da película de substrato 11, na qual em relação à fita adesiva temporária 15, a soma do valor integral calculado a partir do total da soma dos valores da taxa de deformação térmica em qualquer uma primeira direção por 1ºc entre 40ºc e 80ºc medida no momento de aumentar a temperatura por meio de uma máquina de teste de características termomecânicas, e o valor integral calculado a partir do total da soma dos valores da taxa de deformação térmica na segunda direção perpendicular à primeira direção por 1ºc entre 40ºc e 80ºc medida no momento de aumentar a temperatura por meio de uma máquina de teste de características termomecânicas, é um valor negativo.